INSPECTIS Launches C12s ‘Stand-Alone’ Now in Flexible, Modular Format


Reading time ( words)

INSPECTIS AB announces the launch of the new C12s digital camera, a new modular version of the very popular original Inspectis C12. The C12s offers a standalone camera format in a system for those requiring a flexible and cost-effective solution for visual inspection across all subjects.

The C12s camera uses the same large sensor unit as the original C12, delivering crisp, vivid images with auto focus and 12x zoom, can be mounted on any of the extensive range of INSPECTIS stands, and uses all of the available lighting and lens accessories to achieve the desired viewing conditions. Further accessories such as tilt stands, XY tables can be added to optimum object handling.

Cost effective and featuring superior optics and 12:1 optical zoom, the C12s is designed into a robust industrial-grade aluminum housing for high definition image quality. The C12s produces crisp pictures of inspection objects up to 90x magnification directly onto an LCD monitor or PC.

An optional built-in laser pointer aims at the area of interest and assists in locating it on the screen.

Due to the large size of its image sensor and pixel elements, the C12s provides excellent image rendering of such structures as solder joints on PCB assemblies with minimum glare and reflection.

The C12 offers true ease of use with minimal interaction needed with controls and settings. All basic parameters such as zoom, brightness and color levels can be controlled by the user through on-board buttons on top of the device, or through an optional remote control pad. With these control features, camera and lens attributes, including focus, aperture size, image contrast and white balance, are all controllable, and features including zoom factor display and a crosshair overlay on the live image can be turned on.

About Inspectis AB

INSPECTIS provides advanced optical inspection solutions for PCB assembly, high definition camera microscopes designed for non-contact optical inspection. For more information, visit www.inspect-is.com.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.