Universal's APL Shares AREA Consortium Research at SMTAI


Reading time ( words)

Universal Instruments’ Advanced Process Lab (APL) will be exhibiting on booth #1215 at the SMTA International 2019 Exhibition in Rosemont, Illinois, September 24–25. Experts from the APL will be on hand to discuss current and next-generation technology challenges with attendees. The APL will also present at multiple technical sessions on topics derived from the ongoing research of the APL’s Advanced Research in Electronics Assembly (AREA) Consortium during the four-day conference, taking place on September 22–26.

On Tuesday, September 24 at 2:00 p.m., as a component of Session MFX2: Reflow Challenges, Auburn University graduate research assistant for the APL’s AREA Consortium, Arvind Srinivasan Karthikeyan will present a paper, entitled "Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components" that explores the phenomenon of solder joint bridging in fine-pitch BGA components reflowed under vacuum.

On Thursday, September 26 at 1:00 p.m., as a component of Session LF3: Low Temperature Solder, Binghamton University graduate research assistant for the APL’s AREA Consortium, Faramarz Hadian will present a paper entitled "Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy." This paper examines the migration of Bi in Sn-Bi solder joints under prolonged current flow and the possible consequences on mechanical properties and joint reliability.

Also on Thursday, September 26, at 3:30 p.m., as a component of Session LF4: Lead-Free Reliability II, AREA Consortium Manager and SMTA Distinguished Speaker, Jim Wilcox will present a paper entitled "Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing." This paper will address the demand for Pb-free solder alloys that exhibit superior performance in harsh environments by examining the microstructural evolution of two different high-reliability solder alloys in both accelerated thermal cycling and accelerated thermal shock testing. Wilcox will also co-chair Session APT4: Wafer-Level Packaging on Wednesday, September 25.

“We’ve been presenting at SMTA International for many years and each year, it continues to evolve and get even better,” said APL Director, David Vicari. “It is the perfect forum to exchange leading-edge knowledge and ideas with the brightest people in our industry, as well as offering the opportunity to mingle with some of our closest friends—both old and new—in the electronics community. Every year, we learn something new that we can apply in our own research and business objectives and, hopefully, we help some of our peers at the show do the same.”

The two-day exhibition will host more than 170 companies representing every facet of the industry. The conference features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.