iNEMI’s PCBA Cleanliness End-of-Project Webinar

Reading time ( words)

iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Using single-row QFN component packages as a representative example of a BTC on a multi-quadrant test board, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). This was followed by surface insulation resistance (SIR), ion chromatography (IC) and other testing to determine the trade-offs between electrical performance, ionic contamination levels, and cleanliness.

Join the PCBA Cleanliness project team to review the results of their work. Two sessions are scheduled, and the webinar is open to members and non-members. Registration is required.

Session 1 (APAC)

Tuesday, October 8
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now

 

Session 2 (EMEA and Americas)
This session rescheduled

Monday, October 7 (Originally scheduled for Tuesday, October 8)
11:00 a.m. — noon. EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now

 

04/22/2021 | Patty Goldman, I-Connect007

In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

04/22/2021 | Brent Fischthal, Koh Young America

Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

04/14/2021 | Brent Fischthal, Koh Young America

A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.