iNEMI’s PCBA Cleanliness End-of-Project Webinar

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iNEMI’s PCBA Cleanliness project looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Using single-row QFN component packages as a representative example of a BTC on a multi-quadrant test board, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). This was followed by surface insulation resistance (SIR), ion chromatography (IC) and other testing to determine the trade-offs between electrical performance, ionic contamination levels, and cleanliness.

Join the PCBA Cleanliness project team to review the results of their work. Two sessions are scheduled, and the webinar is open to members and non-members. Registration is required.

Session 1 (APAC)

Tuesday, October 8
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now

 

Session 2 (EMEA and Americas)
This session rescheduled

Monday, October 7 (Originally scheduled for Tuesday, October 8)
11:00 a.m. — noon. EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now

 

10/09/2019 | Real Time with...SMTAI

The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

09/27/2019 | Andy Shaughnessy, I-Connect007

During the IPC Summer Meetings in Raleigh, North Carolina, I sat down with Tom Rovere, a materials and process engineer at Lockheed Martin in Owego, New York. We explored a panel discussion on bottom-terminated components (BTCs) that Tom participated in as well as the challenges and issues related to BTCs and the important role that designers play in that process.

08/30/2019 | Marissa Pati and Ana “Lety” Campuzano-Contreras, BAE Systems

The development of an automated circuit card assembly (CCA) conformal coating process using a low-outgassing polyurethane material was essential for meeting the increase in customer demand from 3,000 to 60,000 units per year.