TopLine CCGA, Large BGA Solutions to Highlight Exhibit at productronica


Reading time ( words)

TopLine’s CCGA column grid array IC packages and large ball grid array (BGA) package solutions will highlight the company’s exhibit at productronica 2019. TopLine will exhibit in Hall A3 Booth 102, in the USA Pavilion.

In making the announcement, Martin Hart, President, stated, “We’re reaching out especially to international customers at the show to introduce them to these enabling technologies. In fact, we’ve been continuously active in promoting our products in the global market for almost 30 years. We’re especially excited about the benefits of CCGAs, as well as our large BGA package solutions.”

TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (ball grid arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

Hart states that “Currently, the largest field orogrammable gate array (FPGA) BGAs are 45mm x 45mm in size. But there is a movement trending to produce larger BGAs such as 50mm x 50mm and even 60mm x 60mm. But the ‘super-sized’ BGAs of 70x70mm to 100x100mm exhibit additional stress, resulting in warpage and other difficulties.” Hart adds that “Industry leading suppliers of semiconductor and infrastructure software products, such as Intel, Huawei, Broadcom, and others, are beginning to produce ‘super giant’ BGA packages with multiple die inside that have accompanying stability issues. At TopLine, we maintain that these larger BGAs can benefit by using solder column technology instead of BGA solder balls. This is our solution to stress-related stability issues. We’ll be talking about and showing our solution in Hall A3 Booth 102, in the USA Pavilion.”

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

04/14/2020 | Pete Starkey, I-Connect007
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.



Copyright © 2020 I-Connect007. All rights reserved.