SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

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Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed the challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

To watch the interview, click here.

06/19/2020 | I-Connect007 Editorial Team

The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

06/10/2020 | I-Connect007 Editorial Team

The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.

06/09/2020 | Pete Starkey, I-Connect007

Continuing the series of webinars highlighting recently-published chapters of iNEMI’s 2019 Roadmap—the comprehensive guidebook to the future goals and needs of the electronics manufacturing industry—the installment on optoelectronics examined and discussed data transmission by optical technology. Pete Starkey provides an overview.