SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

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Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed the challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

To watch the interview, click here.

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions

Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

05/06/2020 | Nolan Johnson, I-Connect007

Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

05/05/2020 | Donna Vareha-Walsh, Indium

Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.