MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab


Reading time ( words)

MIRTEC has installed one of its award-winning MV-6 OMNI 3D AOI systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability. 

Brian D’Amico, president of MIRTEC’s North American Sales and Service Division stated, “We are very excited to partner with Universal Instruments’ in placing one of our technologically advanced 3D AOI systems in their Advanced Process Lab. Our intention is to collaborate on new inspection solutions for the electronics manufacturing industry, combining the strengths of MIRTEC’s 3D inspection technology with the expertise and process knowledge of UIC’s personnel. We look forward to a long and prosperous relationship moving forward.”

MIRTEC’s industry acclaimed MV-6 OMNI 3D AOI machines are configured with the company’s exclusive OMNI-VISION® 3D inspection system which combines 15 Mega Pixel CoaXPress camera technology with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D system. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow.

Fully configured the MV-6 OMNI systems feature four 10 mega pixel side-view cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera as well as an 8-phase COLOR lighting system to provide precision inspection of SMT devices on finished PCB assemblies.   

About Universal Instruments Corporation (UIC)

Universal Instruments Corporation (UIC) is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. UIC delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.

For more information about MIRTEC’s technologically advanced 3D inspection systems, please visit: www.mirtec.com.

Share




Suggested Items

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.