Nathan Trotter Wins Mexico Technology Award


Reading time ( words)

Nathan Trotter announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Bar & Wire for its NT100Ge. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Available in solder bar and wire, NT100Ge has an identical chemical composition and is a seamless drop-in replacement for the well-known SN100C® solder.  Produced with the highest quality raw materials and delivering the industry’s best price-performance ratio, NT100Ge lowers cost of ownership, raises competitiveness and produces high-integrity interconnects.

Serving as a successful alternative to silver bearing solders, the eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements. With a melting temperature of 441°F, NT100Ge is compatible with all wave and selective solder equipment. As an added feature, the germanium level has been boosted slightly in NT100Ge, which keeps the alloy in spec longer and reduces the need for costly replenishers. 

For PCB fabrication applications such as the hot air solder leveling (HASL) process during which copper levels increase, NT100GeX provides a low-copper solder solution. NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C® solder bath, without the need for pot dumps or swaps. 

Luke Etherington, Vice President of Sales at Nathan Trotter, says “We have received a very positive response from the market with NT100Ge and look forward to continuing this momentum for the long term.  We are presenting customers with the opportunity to maintain high performance standards while reducing material costs and that is a powerful combination.”

As the largest importer of tin in North America, Nathan Trotter offers industry-best pricing and flexible purchasing programs. Nathan Trotter also offers a leading-edge solder recycling program through its reclaim division, Tin Technology and Refining, that provides customers with maximum value for their solder scrap including dross and oxide, pot dumpings, paste and solder debris. Reclaim material can be exchanged for new solder or payment, enabling customers to reduce raw material costs in an environmentally responsible way.

Nathan Trotter is represented in Mexico by 4 warehouses, 9 Sales Managers, and 2 Technical Support Reps to ensure that every customer is fully supported in all aspects of the business.

The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers over the last 12 months.

About Nathan Trotter & Co.

Founded in 1789, Nathan Trotter has grown to become the largest tin manufacturer in North America.  ISO 9001 certified since 1997, Nathan Trotter currently serves the Automotive, Aerospace, Electronics, Plating, and Chemical industries globally. For sales or customer service please contact Nathan Trotter & Co. at nathantrotter.com

 

 

Share

Print


Suggested Items

SMTA 2019 International Awards

09/30/2019 | Nolan Johnson, I-Connect007
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.



Copyright © 2019 I-Connect007. All rights reserved.