Indium Corporation to Feature Innovative New Alloy at IPC APEX Expo 2020

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Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.

Durafuse^™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications with reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse^™ LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performs better than SAC305 with optimum process setup. Durafuse^™ LT:

• Provides a solution for heat-sensitive components and flex polymers
• Prevents thermal warpage of processor components and multilayer boards
• Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications.

To learn more about Indium Corporation’s innovative low-temperature technology, stop by the company’s booth at APEX (#1037), or reach out to our Technical Support Engineers at askus@indium.com. 

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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