Meet with the 'Heat to Data' Experts at APEX: Visit KIC in Booth #1126


Reading time ( words)

KIC announced that it will exhibit in Booth #1126 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The Heat To Data Experts, KIC will offer solutions for reflow, wave and curing thermal problems. Attendees are invited to bring problems and future concerns to Booth #1126 and KIC’s experts will work to find and demonstrate solutions.

Are any of these your challenges?

  • Too many NPIs to setup
  • Running profiles too often
  • Voiding
  • Getting AND staying in-spec for challenging assemblies
  • Downtime
  • Profile Audits
  • Wrong oven recipe loaded
  • Guaranteed process control through the reflow, wave, curing process
  • Barcoding/traceability
  • MES connectivity
  • Data analytics
  • Rework 

KIC’s automatic profiling system and complete thermal ecosystem has these solutions and more.

Have SPI and AOI but not RPI? Find out what you’re missing without Reflow Process Inspection. With RPI i4.0, and KIC’s NPI and process setup tools, all relevant data can connect to the factory MES or your factory data collection system to be easily analyzed and shared with personnel for clear factory analytics, optimization and corrective action.

Move toward the future of line connectivity, flexible production, machine learning and real-time insight. Visit KIC at Booth # 1126 at the IPC APEX EXPO or call +1.858-673-6050. For more information about KIC, visit www.kicthermal.com.

Share

Print


Suggested Items

PCB Repair: Thoughtful Best Practices

12/31/2019 | Barry Matties, I-Connect007
Barry Matties recently spoke with Curtis Smith of Huntron about the critical factors that somebody needs to understand about the plant maintenance regarding the PCB repair process. The PCB repair process is not just a matter of just getting the equipment anymore but finding the right people with a troubleshooting mindset that can do it. A failed PCB can bring down an entire manufacturing line, and companies need to be able to repair the board and keep their manufacturing going.

Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation

12/19/2019 | I-Connect007 Editorial Team
The latest book in I-Connect007’s "The Printed Circuit Assembler’s Guide to…" series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.

Meet Alfred Macha, SMT007 Columnist

11/06/2019 | I-Connect007 Editorial Team
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.



Copyright © 2020 I-Connect007. All rights reserved.