Koh Young to Showcase AI-based Inspection Solutions at IPC APEX EXPO 2020


Reading time ( words)

Koh Young, the industry leader in 3D measurement and inspection solutions, will showcase advanced Artificial Intelligence-based inspection solutions at IPC APEX EXPO during 04-06 February at the San Diego Convention Center. At the show, Koh Young will show solutions that help manufacturers improve their production process. It will also take part in several show events, including the IPC CFX production line and roundtables focused on smart factory connectivity and inspection processes.

While many will talk about a clear vision in 2020, Koh Young has been following its passion for years: “Without fear of failure, we will pursue the singular goal of developing the best inspection and measurement solutions for the industries we serve, while delivering innovative technologies to overcome process challenges that will improve the livelihood of our customers.” During IPC APEX EXPO, Koh Young will highlight these solutions including solder paste inspection (SPI), automated optical inspection (AOI), automated pin inspection (API), machining optical inspection (MOI), and conformal coating inspection (CCI). Additionally, Koh Young will display Industry 4.0 solutions, including the latest KSMART solutions with autonomous process control across the line.

After visiting the Koh Young booth to learn how we are solving the industry’s inspection challenges, we urge show attendees to visit the IPC CFX Demonstration line that highlights the IPC CFX (IPC-2591) and HERMES (IPC-9852) standards. The demonstration allows visitors to experience a connected factory and realize that when each machine speaks the same language, it creates real value as a practical and smart manufacturing environment. “The power of these communication standards is amplified when combined with the Koh Young KSMART software suite, which was designed to help users realize a smart factory,” said Brent Fischthal, IPC-CFX Committee member and Senior Manager of Americas Marketing at Koh Young. “These standards are helping us deploy our smart factory developments. For example, Koh Young Process Optimizer or “KPO” allows our SPI to automatically adjust print process parameters using machine-learning algorithms based on inspection and measurement feedback.” With the help of these standards and our AI-powered developments, Koh Young can autonomously monitor, analyze, and optimize the SMT process. Furthermore, attendees will see more Koh Young equipment configured in smart lines throughout the show in our partner booths.

Juan Arango, Managing Director of Koh Young America, commented, “We have installed well over 16,000 systems, which have been complemented with customer accolades and industry awards alike. Clearly, Koh Young is on the right path to deliver sustainable benefits to its customers, industries, and society.” Throughout the show Koh Young will highlight its latest innovations for the inspection market, including new hardware and software solutions that drive production and process improvements.

We welcome show attendees to visit both 2336 to understand why demanding customers demand Koh Young. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.

About Koh Young

Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it maintains a close relationship with its growing customer base and provides them with access to a global network of inspection and measurement experts.

Share

Print


Suggested Items

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.



Copyright © 2020 I-Connect007. All rights reserved.