TopLine Exhibiting CCGA, Daisy Chain Solutions at IPC APEX 2020


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TopLine will exhibit its innovative CCGA technology and Daisy Chain component solutions at IPC APEX 2020, February 4 – 6, at the San Diego Convention Center. TopLine will exhibit in Booth #2842.

TopLine’s CCGA Column Grid Array IC packages are made with noncollapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. 
 
In addition to CCGA solutions, TopLine also manufactures Daisy Chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. These and other TopLine innovations will be on exhibit in the show booth. 
 
For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co. 

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