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Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.
The year 2020 will be the most active year yet in automotive standards activity. Members from Continental, Bosch, Toyota, Ford, and several others joined IPC standards development task groups to build the IPC-A-610/001 Automotive Addendum, IPC-6012 Automotive Addendum, Cold Joining Press-fit Standard and an automotive handbook which are soon to be released. Several of these same task group members participated in standards development work on IPC/WHMA-A-620D (wire harness standard) and PERM Council for Pb-free electronics.
The Technical Conference hosted a materials session dedicated to Materials for Automotive Applications, including innovative presentations from Auburn University, TactoTek, and MacDermid Alpha Automotive. Lenora Clark of MacDermid Alpha Automotive spoke on automotive safety electronics. TactoTek’s, Outi Rusanen highlighted structural electronics for automotive interiors that offer solutions toward space saving and lighter weight interior parts. Arvind Karthikeyan of Auburn University compared vibration testing results of newly developed lead-free solder material for automotive and harsh environment applications.
Key automotive supplier voices participated in the iNEMI PCB Technology Forum on Materials and Testing Challenges held as part of the Sessions@theIntersection, including Jan Pedersen of Elmatica AS and Lenora Clark of MacDermid Alpha Automotive.
In his workshop, Michael Konrad of Aqueous Technologies shared best practice techniques to mitigate ECM (electrochemical migration) related failures giving key examples from the automotive electronics space.
In addition to automotive-specific topics, the automotive industry influence continues to grow throughout the event in standards development and in discussions on surface reliability and emerging technologies. At the same time, topics of interest to the automotive OEMs and suppliers continue to be introduced or built upon like cybersecurity, e-textiles, and power supply management.
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