Altus Release Product Brochure with New Additions


Reading time ( words)

Following a busy and productive year full of integrating innovative new equipment and forging new partnerships, Altus Group, a leading distributor of capital equipment, has released its new product catalogue for 2020.

The brochure, based on the expansive Altus portfolio, includes the most advanced solutions available in the marketplace. With their finger continually on the ‘electronics’ pulse, the brochure includes all the latest equipment from leaders in the industry including principle suppliers like Koh Young, YJ Link, Rehm Thermal Systems, and Cencorp. There are also some welcome new additions.

“The new catalogue guides customers on the most advanced systems available on the marketplace. The equipment is from some of the most respected suppliers in the industry, and companies that Altus has partnered with for many years,” explained Joe Booth, Altus Director - Business Development and Marketing.

“New for this year there is the inclusion of new partners including Inovaxe, Innomelt, Scienscope and Quick equipment. The new additions have added further breadth and choice to an already expansive portfolio of capital equipment ranges. We hope the carefully selected choice of products offer our customers the most technically advanced equipment for their manufacturing requirements and helps to improve production processes driving manufacturing standards upwards.”

As well as a comprehensive overview of Altus’ products, the catalogue highlights the company’s core objective – exemplary customer service. Altus has taken significant steps to double down on its USP of having the largest support team in the market, with the hiring of two more applications engineers at the end of 2019. This has move has further enhanced the service and support for every customer.

Share




Suggested Items

CyberOptics: New Partnership Shows Promise for Semiconductor Industry

12/28/2022 | Nolan Johnson, I-Connect007
Nolan Johnson checks in with Sean Langbridge, European sales director for CyberOptics, at electronica to discuss details of the recent merger between CyberOptics and Nordson and the partnership’s potential benefits for customers, especially regarding solutions geared toward enhancing the accuracy of test and inspection in advanced packaging. The company’s unique optical technologies, including its MRS sensors and AI² software, are already saving customers hours on the line; with Nordson’s X-ray capabilities in the mix, CyberOptics sees some very compelling technological solutions on the horizon.

The ‘Intel’ on Advanced Packaging Options

11/29/2022 | Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?

Just Ask Paul: Automotive and Lead-Free Solders

10/14/2020 | I-Connect007 Editorial Team
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.