International Electronic Circuits Exhibition (Shanghai) 2020 Postponed

Reading time ( words)

Dear Exhibitors and Prospective Visitors:

To prevent the spread of pneumonia epidemic of new coronavirus infection in Wuhan, Hubei and other areas, Shanghai has scaled up the response to major public health emergencies to Level 1. According to the “Notice on further strengthening the prevention and control of pneumonia caused by new coronavirus infection in Shanghai” released by Shanghai Municipal Committee of the Communist Party of China and Shanghai Municipal People's Government, crowd gatherings shall be minimised, and large-scale public activities shall be cancelled. To protect the health and safety of our exhibitors and visitors, China Printed Circuits Association (CPCA), Hong Kong Printed Circuits Association (HKPCA) and Shanghai YingZhan Exhibition Service Co., Ltd has issued exhibition postponement notice on JAN 30 2020. 

After the negotiation with the National Exhibition and Convention Center (Shanghai), the 2020 International Electronic Circuits Exhibition (Shanghai) will be held in the National Exhibition and Convention Center (Shanghai) from June 22 to 24, 2020. Please be assured that the original venues and the pre-selected booths are unchanged. 

We will keep monitoring the epidemic situation of infection while continuing the communication and consultation with the relevant departments and keep you informed. We apologize again for the inconvenience caused by the delay in the exhibition! We wish you can make appropriate updates and adjustments successfully.

 We are very confident to bring a more important industry event to exhibitors and visitors after the outbreak. Therefore, we will do our best to provide follow-up services for exhibitors and visitors. If you have other questions or need more assistance during this period, please contact us directly. 

Thank you for your understanding and support for the exhibition over the years!

Shanghai YingZhan Exhibition Service Co., Ltd.


Suggested Items

NIST Resources for CHIPS Act Participants

01/27/2023 | Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.

PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show

06/14/2022 | Andy Shaughnessy, I-Connect007
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.

Alun Morgan's productronica Slide Show

12/15/2021 | I-Connect007 Editorial Team
I-Connect007 has been bringing you interviews with a variety of technologists who attended last month's productronica show in Munich, Germany. As part of our continuing coverage of productronica 2021, we present this exclusive slide show of photos taken by our good friend Alun Morgan, technology ambassador for Ventec International Group and a fantastic photographer in his own right. Rumor has it that Lufthansa made him buy a separate seat for that giant camera of his.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.