InduBond Gets Hot With Induction Heating Lamination


Reading time ( words)

During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.

In this video interview from the show, Editor Nolan Johnson sat down to speak with Víctor Lázaro, InduBond’s R&D director and technical manager, about InduBond's latest technology for panel lamination utilizing induction heating. InduBond demonstrates a lamination oven on the IPC APEX EXPO show floor, as well as the advantages of the technology.

IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26-28, 2021, at the San Diego Convention Center.

To watch this interview, click here.

Share

Print


Suggested Items

iNEMI’s PCB Roadmap Explained

05/01/2020 | Pete Starkey, I-Connect007
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

2020 EIPC Winter Conference, Day 2

03/10/2020 | Pete Starkey, I-Connect007
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

Advances in Substrates for Thermal Management

02/13/2020 | Pete Starkey, I-Connect007
Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.



Copyright © 2020 I-Connect007. All rights reserved.