Introducing 'The Fox Pack' State-of-the-art Expandable Placement and Dispensing from Essemtec


Reading time ( words)

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

FOX2 has a machine footprint of just under 11 sq. ft and can accept PCB sizes up to 16" x 12". Components with sizes from 01005 up to 3.15 x 3.15"can be placed. The machine achieves 10,800 cph (IPC9850) at 50 µm (3 sigma) with a two-nozzle head.

The two head version is the best seller based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in very high-mix/small-medium production environments. It has proven to be an excellent system for NPI and prototyping as well. When solder paste dispensing is added to the system the need for screen printing and screens can be reduced or eliminated allowing for board design changes and modifications to be accomplished in real time.

The system is flexible and expandable, plus it can be configured with up to 180 feeders in a truly compact space saving platform.

Essemtec’s FOX2 can be fitted with a Jet valve for SMD glue or solder paste for hassle-free manufacturing of 2.5D assemblies or lower cost micro screw valve. Fox2 also features the company’s award-winning ePlace software which is easy to use and intuitive and featured on all Essemtec platforms.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.