-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Major Suppliers in Electronics Assembly Materials Awarded U.S. Patent for Innolot/Loctite 90isc Alloy
May 13, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
Three major suppliers in electronics assembly materials, MacDermid Alpha Electronics Solutions, Henkel, and Heraeus, received notice that the United States Patent and Trademark Office has issued Patent No. US10376994B2 for their innovative solder alloy formulation marketed under the brand names Innolot (Heraeus & Alpha) and Loctite 90ISC (Henkel). The patent was granted an extended expiration to June 11, 2029.
The technology was developed in a cooperative project to produce a lead-free solder alloy specifically for harsh environment electronics applications. The result was an alloy with markedly improved reliability performance as compared to standard SAC alloys. Promoted in the electronics market for over ten years, the respective Innolot and Loctite 90ISC products are widely recognized as a high-reliability, thermal cycling, thermal ageing and vibration-resistant alloy, making it well suited for automotive applications and assemblies. The Innolot/90ISC alloy is designed to tolerate the demands of high-temperature applications while still being solderable at standard lead-free process temperatures.
The issuance of the U.S. patent is a further achievement for MacDermid Alpha, Henkel, and Heraeus and their efforts towards creating innovative materials for the challenges and demands of today’s electronics assembly. “The issuing of this patent is of strategic and commercial importance,” said Tom Hunsinger, Vice President of Marketing MacDermid Alpha Electronics Solutions, “Coupled with patent protection in Europe and Japan, this will help drive new business opportunities not only in automotive but in other markets with harsh environment challenges.”
MacDermid Alpha Electronics Solutions, Henkel, and Heraeus market Innolot and Loctite 90ISC products in a variety of forms including solder paste, bar solder, and wire. Patents are currently held in EU (EP1617968B1) and Japan (JP5320556B2).
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.