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SMTA Capital Chapter Hosts Webinar on Next-gen pH Neutral Cleaning Products
November 6, 2020 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is excited to host another free webinar on Friday, November 13. The webinar will include an informative presentation given by industry expert Ravi Parthasarathy of ZESTRON Corporation on “Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products.”
Electronic assemblies continue to grow more complex in terms of component design, board density, standoff heights, and increased use of sensitive material sets. Different market sectors may have unique materials sets that need to be considered when developing and/or selecting a chemistry for the cleaning process. These advances continually challenge the cleaning process. Often times, cleaning process improvement can be realized by increasing the cleaner mechanical energy through spray bar design, pressure and configuration, thermal energy by increasing the cleaning agent wash temperature, and chemical energy by increasing the cleaning agent concentration. However, chemical energy can also be increased through increased solvency of the cleaning agent itself.
The presentation will discuss the technical study done by Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Corporation and Terry Price, Ph.D, R&D Scientist, ZESTRON Corporation. In this study, two EMS companies explored alternate cleaning agent options in pursuit of continuous process improvement and meeting new product cleaning challenges. Each company was using an inline cleaner with a water-based cleaning agent and each had an optimized process that met their cleaning process requirements. However, they elected to explore the benefit of a cleaning agent with greater solvency to improve overall process efficiency and cleaning performance.
This presentation reviews their current cleaning process as well as presents field data detailing the cleaning process performance improvements and resulting cleanliness levels achieved on complex electrical assemblies using a cleaning agent with greater solvency. Examples of the new challenges will be discussed, and the resulting field data detailed.
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum
04/25/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Ciudad Juarez Expo & Tech Forum, scheduled to take place Thursday, May 9, 2024 at the Injectronic Convention Center in Ciudad Jaurez, Chihuahua, Mexico. During the event the KYZEN Clean Team will focus on understencil cleaning products KYZEN E5631J and CYBERSOLV C8882.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.