MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Reading time ( words)

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.

Reflectivity of the leadframe surface is a key factor in LED packaging design. Leadframe based LED package manufacturers require a high brightness silver spot plating process that ensures a proper surface for die attach and wire bonding during assembly. The silver finish must also provide lasting reflectivity during end use performance.

MacDermid Enthone’s HELIOFAB AG 7921 spot silver electroplating process consistently deposits highly reflective silver with measured GAM values around 2.0 over a wide current density window of 10 to 70 ASD. The bath produces a stable deposit over the standard 100 AH/L industry bath life metric. The deposit passes all standard testing for LED performance such as 1000-hour luminous decay as well as assembly functional testing for gold wire bond pull and die attach shear strength. The process is currently in high volume production and is specified for OEM use in leadframe LED manufacturing.

“With the release of HELIOFAB AG 7921 we have further broadened our comprehensive portfolio of solutions for leadframe based packages and look forward to helping customers solve manufacturing issues with this highly important and versatile type of IC packaging. The innovative white bright deposit provided by HELIOFAB AG 7921 delivers enhanced LED performance while reducing manufacturing costs through spot plating selectivity.” – Rich Retallick, Director of Electronics Specialties, Circuitry Solutions.

About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at



Suggested Items

This Month in SMT007 Magazine—Continuous Improvement: As Simple as X = Xc – 1

01/04/2021 | I-Connect007 Editorial Team
X=Xc – 1 is a conceptual equation for continuous improvement. You define X and work to reduce it by a factor of 1. This could be one work hour, one process step, one day less in a cycle, and so on. We recently met with Dr. Ron Lasky to discuss the concept of X=Xc – 1 and get his advice on generating enthusiasm among readers and the next generation about continuous improvement. As this discussion illustrates, many process improvements are small in scale, not yearlong, major efforts.

Happy’s Essential Skills: Recruiting and Interviewing

12/29/2020 | Happy Holden, I-Connect007
Printed circuit manufacturing was not one of the jobs that electrical engineers in HP wanted to do. EEs were also not the best choice for printed circuit manufacturing because chemical engineers, chemists, and mechanical engineers had more skills useful to support the PCB manufacturing process. Therefore, I was authorized to recruit external hires. To recruit chemical engineers, we went to those universities noted for their focus on industries like electronics, process control, and environmental...

Book Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

12/24/2020 | Graham Naisbitt, Gen3 Systems
It is assumed that readers are familiar with manufacturing electronic circuit assemblies in accordance with IPC-J-STD-001 or IEC 61189-1; both are titled “Requirements for Soldered Electrical and Electronic Assemblies.” In October 2018, IPC-J-STD-001 Revision G was amended and released with a new Section 8 of the document titled “Cleaning.” The change was primarily the removal of a “cleanliness” level of 1.56 mg/square cm of NaCl equivalence. This small change has great significance in relation to how companies ensure the electrochemical reliability of their products.

Copyright © 2021 I-Connect007. All rights reserved.