IPC Releases IPC-7093A, Design and Assembly Process Implementation for BTCs

Reading time ( words)

The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.             

IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to successfully implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.

Revision A adds state-of-the-art guidance on critical elements for thermal pad design, thermal via usage, stencil design, assembly recommendations, reliability considerations, known issues/ defects to avoid. The standard’s multiple design point options enable reliable BTC designs.

The standard is ideal for anyone involved with physical design, process and reliability engineers or managers who are responsible for design, assembly, inspection, and repair processes.

“BTCs are in integral part of electronic designs today,” stated Matt Kelly, IPC chief technologist. “With increased product functionality, device miniaturization, and increased power consumption the need for optimized thermal management has never been higher.”       



Suggested Items

Implementing Digital Twin Best Practices From Design Through Manufacturing Webinar Review

01/27/2021 | Dana Korf, Korf Consultancy
I-007e recently released a highly informative series of short webinars called Implementing Digital Twin Best Practices from Design Through Manufacturing presented by industry expert Jay Gorajia, the Director of Siemens Global Digital Manufacturing Services. The webinar is an excellent overview how data that is generated using a digital twin model can be effectively utilized to improve business execution using the Siemens tool suite.

Meet Cooler Cao: SMT007 Columnist

01/06/2021 | I-Connect007 Editorial Team
Meet Cooler Cao, the author of one of our newest SMT007 columns, Global Connections. Cooler will cover all aspects of cables, cable assemblies, and wire harness technologies. His aim is to help companies who design and use these technologies to find the best connection solutions.

Part 12 of Siemens’ Digital Twin Webinar Series: MES and Enterprise Systems

11/25/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. To conclude the series, in Part 12, Gorajia discusses, “Integrating Valor Solutions as Part of MES and Enterprise Systems."

Copyright © 2021 I-Connect007. All rights reserved.