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TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
TopLine has employed substantial engineering resources in recent years to develop novel approaches to manufacturability and reliability of CCGA components that are usable with Field Programmable Gate Arrays (FPGA) and Application-Specific Integrated Circuit (ASIC) Packages. CCGA packages are assembled with solder column terminations that reduce stress in harsh environments, stresses resulting from wide temperature swings when mounting materials having different coefficients of thermal expansion (CTE) onto Printed Circuit Boards (PCBs).
Martin Hart, CEO, stated, “Our unique lead-free solder column is designed with an inner copper core that prevents collapse of the semiconductor chip that also serves as a heat-sink to conduct heat from the underside of the CCGA package, resulting in enhanced reliability. The novel Pb-Free column structure conforms to RoHS directives that assure Restriction of Hazardous Substances in electrical and electronic equipment. We’re pleased to have been awarded this patent.”
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
Nolan Johnson, I-Connect007
Nolan Johnson talks with Shaun Dykes, a 50-year expert in the mining industry. Dykes gives a concise primer on mining development, and the amount of time and effort required to develop and supply the mineral resources we depend upon for the manufacture of printed circuit boards. There are many factors that play into when and where a mine is developed—and what can prevent a mine from ever producing minerals.
I-Connect007 Editorial Team
In a recent conversation with Ventec’s Alun Morgan, the I-Connect007 Editorial Team discussed, among several topics, semiconductor packaging developments. Industry insiders will know that, when you get Happy Holden and Alun Morgan talking about emerging technology trends, there will be insights shared.