Takaya Launches APT-1600FD-SL Dual-Sided Flying Probe Tester

Reading time ( words)

Takaya’s APT-1600FD-SL dual-sided flying probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (battery management system) applications. The "-SL" series provides a 48% larger test area, which aligns perfectly with applications including semiconductor test probe card manufacturers. These customers urged Takaya to increase the test area of their dual-sided system.

“Our customers spoke, and we listened,” said Roy McKenzie, Takaya Group Manager. “Their boards are very large, and simultaneous probing on both sides of the board is required to verify continuity of this complex circuitry. We responded, adding the capability that they wanted to achieve faster, more efficient testing.”

The APT-1600FD-SL deploys the flying probes to both sides of a UUT. This dual-sided probing contact contributes to a marked increase in test coverage and also ensures the shortest amount of test time. As with other models within the APT-1400F/APT-1600FD family, It provides average head-speed increases of up to 50% with throughput improvements of 30-50% over existing models, making it the industry’s fastest flying-probe test system. The APT-1600FD-SL incorporates a new 10-flying-Z-axis design, including four vertical flying probes that provide unequaled access to test points where conventional angled probes fail to contact. Its six top-side and four bottom-side flying probes deliver the unprecedented performance found only from Takaya, the inventor and industry leader in flying-probe test technology for more than 25 years. 

Takaya’s “soft touch” probing virtually eliminates the presence of witness marks often associated with flying probe test.  To help compensate for board warpage, the system now comes equipped with a laser profiling system.  Prior to testing a PCA, the surface of the board is scanned and the system automatically compensates for any warpage, guaranteeing maximum probing accuracy.

The APT-1600FD series is equipped with new vision test system TOS-7F corresponding to color images as standard on both top and bottom side. Owing to the megapixel color digital camera and the ring illuminations with high-intensity white LED, the TOS-7F can import sharp color image to detect missing, wrong orientation and positioning error on the spot.

Next generation, high-precision measurement electronics are embedded in the flying heads allowing for greatly improved measurement accuracy and increased functional capabilities. The new measurement system includes multiple four-quadrant source and measurement units, plus an AC sine and square wave generator and frequency counter, providing the ability to perform dynamic characteristic tests of components and circuits.  An enhanced function scanner board and communications software make it easy to connect external instrumentation for additional functional-test capabilities.


Suggested Items

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/01/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

ICT or Flying Probe: Which Test Is Best for Your Assembly?

07/10/2019 | Russell Poppe, JJS Manufacturing
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).

Design for Test in the U.S. Market

03/17/2016 | W. Scott Fillebrown, LIBRA INDUSTRIES INC.
With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue.

Copyright © 2022 I-Connect007. All rights reserved.