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BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced plans to exhibit during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will showcase its Aqua Scrub™ Flux Management Technology in Booth #3412.
Aqua Scrub Technology is BTU’s next-generation solder reflow flux management system. The patent-pending design uses an aqueous-based scrubber technology compatible with most known paste and flux types. The flux and solution are automatically contained and packaged for disposal.
The Aqua Scrub has a very attractive cost of ownership and is designed to decrease operational cost by 4X compared to traditional condensation systems. Reduction in cost can be attributed to reduced downtime, labor and disposal costs.
The Aqua Scrub is purpose-built as a stand-alone system that can be easily retrofitted on PYRAMAX™ reflow ovens already in the field as well as being configured on new PYRAMAX ovens. This self-contained unit mounts on the back side of the oven to minimize the impact on oven operation and factory floor space.
To learn more visit www.btu.com.
I-Connect007 Editorial Team
The sixth episode, “Materials Testing—Process Materials,” can be viewed in under four minutes. Presenters share information on paste vs. flux vs. rework, limitations of standards, hand soldering/rework cautions, and more. Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive, or general industrial applications.
Nolan Johnson, I-Connect007
At SMTA International 2021, Nolan Johnson spoke with Rob DiMatteo of BTU International about the current shift in market drivers, pain points from customers, and what he expects to see in the near future. Chip shortages and port delays are just two of the challenges facing BTU’s customers. As general manager of BTU, DiMatteo wants his company to excel at customer service despite these challenges. He also previews a new flux management technology for keeping reflow ovens extremely clean, calling it a significant breakthrough.
Pete Starkey, I-Connect007
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