Indium Corporation Products ‘Live@SMTAI’


Reading time ( words)

Indium Corporation will feature its proven solder solutions live on the show floor throughout SMTA International from Nov. 1-4 in Minneapolis, Minn., USA.

Live@SMTAI is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, its industry partners, and, most importantly, the customers who get to experience the equipment and materials in a live-action environment.

This year’s program will highlight Indium Corporation materials, including: 

  • CORE 230-RC flux-cored wire
  • Durafuse™ LT, patent-pending low-temperature alloy system
  • Indium8.9HF Solder Paste
  • Indium12.8HF microdispense and jetting solder paste
  • Sn995 solder wire

You can see these products at the following partner booths: 

  • ASM (booth #3025)
  • ITW EAE (booth #3425)
  • JBC Tools (booth #3129)
  • KOH Young America (booth #3319)
  • KYZEN (booth #3325)
  • Mycronic (booth #3213)
  • NSW Automation (booth #3339)
  • PARMI USA (booth #3116)
  • Pillarhouse (booth #3324)
  • Trans-Tec America/Yamaha (booth #3113)
  • ZESTRON Corporation (booth #3207)

By demonstrating Indium Corporation products on live equipment at the SMTAI show, attendees get an accurate and honest depiction of the material’s performance. If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatSMTAI.

SMTA International is co-located with MD&M Minneapolis.

Share

Print


Suggested Items

Ron Lasky: A Perspective on Writing About Solder Defects

12/02/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Dr. Ron Lasky About "The Printed Circuit Assembler’s Guide to... Solder Defects." Ron is a full professor at Dartmouth College, but works part-time at Indium Corporation, helping their customers solve defects. This I-Connect007 eBook, he says, is a compilation of all he’s learned over the years as well as the deep technical knowledge of the team at Indium.

Organizational and Team Management in Times of Change

09/01/2020 | Barry Matties, I-Connect007
Ross Berntson, president and COO of Indium Corporation, shares his perspective, thoughts, and lessons learned on managing his global organization as Indium Corporation responds to health issues, market demand shifts, and organizational change. This interview was conducted in May 2020.

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.



Copyright © 2021 I-Connect007. All rights reserved.