-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Seeed's Open Parts Library (OPL) Adds SnapEDA Models for Faster Electronics Production
October 22, 2021 | PRNewswireEstimated reading time: 2 minutes
Seeed, a leading global electronics manufacturer based in Shenzhen, is adding SnapEDA computer-aided design (CAD) models to the Seeed and Shenzhen Open Parts Libraries (OPLs), to help electronics designers move from idea to fabrication with ease.
The OPLs are a collection of commonly used components, designed to be used with the Seeed Fusion PCB Assembly (PCBA) service, that are widely available in the supply chain, cost effective, and design-for-manufacturing (DFM) friendly. Today it contains a wide selection of over 150,000 commonly used parts, from integrated circuits (ICs) to passives, to cut costs and reduce the turnaround times for turnkey PCB assembly.
During the parts selection stage, the OPLs save engineers time and reduce delays, since the parts are carefully selected to ensure they are widely available in the local supply chain, eliminating the need to import parts and undergo lengthy and costly customs clearance processes. This is especially helpful given the current global component shortage affecting the electronics industry. In addition to preventing delays, engineers also save money since the components in these libraries are sourced from Seeed's affiliated partners network and/or are purchased in bulk.
During the design and manufacturing stage, the addition of the SnapEDA CAD models to the OPLs make them even more valuable. By downloading ready-to-use CAD models for the parts they select, engineers can save weeks of time, and reduce costly prototype iterations during the manufacturing process.
To get started with the new SnapEDA integration, engineers simply visit the Downloads section on the Seeed's OPLs. Once they click the Symbol, Footprint and 3D model link, a viewer will popup allowing engineers to preview the models, and download instantly.
"With the current constraints in the global electronic component supply chain, we're pleased to be able to support the Seeed and ShenZhen open parts libraries, which are helping engineers streamline part selection and manufacturing. With the addition of SnapEDA models, engineers will now be able to design-in these parts in mere seconds," said Natasha Baker, Founder and CEO of SnapEDA.
Before SnapEDA, engineers needed to spend hours of time creating digital models from scratch. With the sheer number of components a project can have, the process of creating and verifying each component can be tedious and error ridden. This is why SnapEDA created the first search engine focused on CAD models, as well as its own patented verification technology to optimize the quality of each model.
Over 15 PCB design formats are accessible with the new SnapEDA integration in the Seeed and ShenZhen OPLs, including Altium, KiCad, Fusion360, Cadence Allegro, OrCAD, EAGLE, DesignSpark PCB, DipTrace, Proteus & more.
Engineers can also find SnapEDA's symbols, footprints and 3D models on the main SnapEDA website, as well as on distributors' websites including Digikey, Mouser, and RS Components' DesignSpark. SnapEDA can also be found in software tools like Autodesk Fusion 360, Proteus and DipTrace. Millions of engineers are benefiting from the syndication of these CAD models on over 30 affiliated partners' platforms.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.