-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
GÖPEL electronic's New SYSTEM CASCON Software Version with Numerous Features
November 24, 2021 | GÖPEL electronicEstimated reading time: 1 minute
SYSTEM CASCON is the GÖPEL electronic software platform. It serves as the basis for all test techniques such as JTAG/Boundary Scan/IEEE1149.x, Processor Emulation Test, FPGA Assisted Test, Embedded Diagnostics Test, but also for design validation, for debugging, for various programming strategies and for interaction with other external test equipment.
With the new update, a generator, compiler and implementer are now available for IJTAG/IEEE1687 tests. This primarily increases ease of use and execution speed. In addition, analogue switches, level shifters and similar components are now supported in the interconnection test. The end result is that the overall test coverage is increased.
Test procedures for testing RAM memories are already an integral part of SYSTEM CASCON. With the new version, these can now also be tested according to the standard DDR4 connectivity test. This improves test times and diagnostic options.
As a further feature, the Visual Project Explorer (ViPX) has been extended by a new test system view. This provides an overview of the configured test system. With an automated multi-scan chain detection of boards, it also offers fast, interactive access to the test object.
The most visible feature of the new SYSTEM CASCON version is the updated window structure. The individual areas are now more clearly divided into development, board, execute and TCA windows. As a result, the Embedded JTAG Solutions software platform is even easier to use.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
Sypris Receives New Releases Under Electronic Warfare Program
05/03/2024 | Sypris Electronics LLCSypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has recently received additional releases under a multi-year production contract that was first announced in 2022. The order, which provides for Sypris to begin deliveries in 2024, calls for the manufacture and test of electronic assemblies for an additional four systems to be supplied to a U.S. DOD contractor.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.