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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 26, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week.
We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”
North American PCB Industry Sales Up 6% in October
Published November 24
“PCB orders fell slightly in October but remain well above 2020 levels and are 2.3 percent higher than 2019 levels,” said Shawn DuBravac, IPC’s chief economist. Check out the rest of the numbers here.
All Flex Discusses Merger and New Medical Applications
Published November 19
Jamin Taylor sat down with I-Connect007 at a recent technical conference to discuss the All Flex/Printed Circuits merger, as well as some new creative flex applications.
Happy's Tech Talk #2: Induction Lamination
Published November 23
If you thought the lamination process could never change, then think again. In Happy Holden’s second installment of the Tech Talk series, Happy details the induction lamination process. Read on to learn all about this new technology.
Foxconn Shared the Best Practices of Green Chemistry
Published November 22
With the business formula “Sustainability=EPS+ESG,” Foxconn begins to implement the U.N.’s SDGs (sustainable development goals), with an end goal of "responsible production.” Read more about how Foxconn is prioritizing sustainability.
Happy 99th Birthday to Harvey Miller!
Published November 23
Still active in the industry at 99 years old, the I-Connect007 staff is looking forward to the possibility that we’ll see Harvey in San Diego come January. Click through to find our 2016 interiew with Harvey, titled “What a Long, Strange Trip it’s Been—and It’s a Long Way from Being Over.”
Suggested Items
Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/07/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.