-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Solderstar Introducing North America to Latest Profiling Systems at IPC APEX EXPO
November 26, 2021 | SolderStarEstimated reading time: 2 minutes
Following a successful European show at productronica in Germany, Solderstar a leading supplier of profiling equipment for reflow, wave, vapor and selective soldering, is ready to present its latest innovations to the North American region when they attend IPCAPEX EXPO, in San Diego, California from 25-27 January 2022.
Solderstar will put the spotlight on two of the company’s newest products including the VP Nano system and the Solderstar SLX, a state-of-the-art zero set-up thermal profiler.
Chris Williams, Solderstar Business Development Manager said: “Apex will be the first exhibition that Solderstar has attended in America for two years due to the pandemic. We are therefore very much looking forward to sharing our latest products with the electronics industry in this territory.
“We have spent the last two years re-evaluating and reviewing our products. It was the perfect opportunity to spend quality time on new product design and allowed us the opportunity to come up with the new SLX datalogger.
“We collated information from the field teams and of course from our customers, to look at what the industry needed and how the process of thermal profiling could be improved. The feedback we received was for systems to include ease of set up, error-free processing, and for everything to be backwards compatible with the thousands of SMARTLink accessories existing in the market. This created the basis of a new set of goals. Armed with this knowledge and our own objectives to produce best-in-class products the SLX datalogger was conceived. The SLX is a complete ground up design with all aspects of the product improved and redeveloped. SLX maintains compatibility with older products, but importantly offers a powerful platform to build new measurement solutions, with parameter measurements for emerging processes and future capacity.
“What makes Solderstar SLX so unique is that it requires no measurement setup. It is an accurate, robust, ultra-compact, battery-powered datalogger used for measuring and recording process parameters from any soldering process. Since introducing the new product we have received exceptional interest and this will be the main focus for us at Apex.
“The unit can be plugged onto any SMARTLink reflow heatshield or other process accessory and the system will directly read and auto-configure itself to quickly enable the correct number of thermocouples as well as every other process parameter sensor. The user does not have to redefine the system before each use. This feature is a huge benefit to the customer as they can down-skill the profiling workload. Additionally, it has 12 separate memories for individual profiles, so the user only has to go back to the PC and download once they’ve finished profiling every process in the manufacturing area- a great time saver!
“We are very much looking forward to presenting the new SolderStar SLX at Apex, together with our other innovative products.”
As well as introducing visitors to the SLX datalogger, Solderstar will present another new addition, VP Nano. This impressive system allows users of batch and in-line vapor phase soldering machinesto fully profile products in the same way as a conventional reflow oven.
VP Nano features a rechargeable micro-miniature profiling datalogger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapor reflow and vacuum stages of the machine. Once data capture is complete, the heat shield can be opened and the datalogger removed to allow for rapid cool-down cycles minimizing the risk of overheating the profiling unit.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.