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In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The eighth episode, “New IEC Standards—A Walk Through” can be viewed in just over five minutes. Presenters discuss scope, measurement technique, the B52 and field gradient, dummy components and the test chamber.
Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.
Tracy Riggan, IPC
A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision.