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GEN3 Webinar Concludes With Release of Part 11: Historical Background
February 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The final episode, “Historical Background” can be viewed in just under seven minutes. Presenters discuss IPC and the DoD, IEC, and provide summary recommendations and reference materials.
Visit Predicting Reliability in Electronics and start watching, free, today!
According to Andy Levesque, principal electrical engineer at Gentex Corporation, "Predicting Reliability in Electronics is a nicely put together series. SIR can be a dry subject, and the pace of the short episodes were very well done. I wish I’d had access to this when I started working with SIR earlier in my career."
Designed to complement their book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series by GEN3 can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.