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SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
PF735-PQ10-10 can reduce the reflow temperature to below 190°C, thus decreasing PCB and substrate deformation. Additionally, the solder paste saves energy, reduces thermal stability requirements of PCBs and components, and increases yield rates. This makes it ideal for SMT devices with sensitive components.
SHENMAO’s PQ10 series of low-temperature solder paste offers some important benefits when it comes to SMT assembly. When compared with SnAgCu, the PQ10 series of low-temperature solder paste offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components. In comparison with the Sn42/Bi58 Eutectic alloy, the PQ10 series offers better ductility, finer microstructure, and increased drop and thermal reliability.
PF735-PQ10-10 is Halogen-free (ROL0) with no halogen intentionally added. It complies with RoHS, RoHS 2.0 and REACH.
I-Connect007 Editorial Team
The San Diego sun was warm and bright on Wednesday afternoon, but it didn’t stop the crowds from filling the aisles at IPC APEX EXPO 2023 for the trade show’s second official day. Technical conferences, professional development courses, and a keynote from IPC President and CEO John W. Mitchell kept attendees busy. But the real highlight of the day was upstairs where approximately 300 high school students from the local San Diego area rode buses to the San Diego Convention Center for a day full of activities meant especially for them.
Charlene Gunter du Plessis, IPC Education Foundation
IPC has a responsibility to its current members but also in attracting and retaining new talent to the electronics manufacturing industry. This is no more evident than in the STEM event hosted by the IPC Education Foundation at IPC APEX EXPO. For the 2023 event, more than 500 students from nearly a dozen high schools are expected to participate in hands-on activities, touring the show floor, and learning from industry experts. The Career Panel Luncheon will expand across the in-person event as we broadcast and stream to schools across the United States.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”