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The SMTA is pleased to announce the finalized technical program for the International Conference for Electronics Hardware Enabling Technologies. The in-person conference will take place June 14 - 15, 2022 at the Centennial College Event Centre in Toronto, Ontario, Canada.
Two half-day Professional Development Courses (PDCs) are scheduled for Tuesday, June 14. Dale Lee, Plexus Corp. instructs the first course on “Tolerance Mistaken: DFM Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.” The afternoon course, instructed by Peter Jacobs, Ph.D., EMPA, covers “Electrostatic Discharge in Robotic Manufacturing Lines.”
The technical program continues on Wednesday, June 15 with a full day of presentations organized into sessions on the following topics: Cleaning and Reliability, Defect Elimination, Power Design, Assembly & Test, Solder & Materials.
Peter Jacobs, Ph.D., EMPA, will keynote the conference with his presentation titled “Early Life Failures in Automotive Electronics and their Root Causes.”
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.