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KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, Aug. 25, 2022 at the Sheraton Chihuahua Soberano in Chihuahua, Mexico. The KYZEN team will showcase the award-winning KYZEN® E5631 and E5631J Next Generation Stencil Cleaners as well as CYBERSOLV C8882.
E5631-E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. The stencil cleaner is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil and ultrasonic systems.
The stencil cleaner was formulated to operate at low concentrations (<25 percent) while remaining a top performing product. E5631 provides superior and exceptional cleaning of ALL widely used assembly materials. Additionally, it rinses easily and completely thus reducing typical dry time.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”