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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Mycronic Receives Order for Three SLX Mask Writers
September 9, 2022 | Mycronic ABEstimated reading time: Less than a minute
Mycronic AB has received an order for three SLX mask writers from an existing customer in Asia. The order value is in the range of USD 17-21 million. Two systems are planned for delivery during the fourth quarter of 2023, while the third system is planned for delivery during the first quarter of 2024.
The SLX laser mask writer meets rising demand for photomasks for the semiconductor industry and a future need for replacement and modernization. Photomasks manufactured by laser mask writers are of high importance and account for 70-75 percent of all photomasks produced for semiconductor manufacturing. SLX is a new and modern mask writer based on the same technology as Mycronic’s mask writers for displays.
“SLX’s modern and flexible platform is well suited to meet different customer needs, which in this case is manifested by a repeat SLX order from an existing customer. This time the order is for three systems in two different configurations”, says Charlott Samuelsson, Sr VP Pattern Generators at Mycronic.
Mycronic provides mask writers for display manufacturing and production of semiconductors.
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The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.