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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
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IPC Training Course on PCB Design for HDI and Advanced Packaging
September 15, 2022 | IPCEstimated reading time: Less than a minute
IPC will be holding an online training course on printed circuit board (PCB) design for HDI and advanced packaging. This course will provide the skills necessary to create PWB/PBA designs that require advanced or complex packaging—including boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing; non-standard board outline geometry; non-standard board mounting; and advanced board materials.
Taught by an IPC-certified industry expert, the six-week program—to be held from October 27 to November 23 (every Mondays and Wednesdays at 11:00 am to 1:00 pm)—utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers.
This course is ideal for individuals who need further experience with packaging and routing challenges involved with modern high density, reduced board area, and complex geometry designs.
Upon completion, participants will be able to compress circuit topology while maintaining circuit performance; understand the trade-off of advanced PCB materials; define a board stackup that take implements micro-vias; define and implement non-standard (non-orthogonal) parts placement and routing; and define non-standard PCB mechanical retention and keep-outs.
For more information or to register, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.