Hentec/RPS Receives Order from Satic USA for Vector 600 Selective Soldering System


Reading time ( words)

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Satic USA has selected Hentec/RPS as their selective soldering partner of choice. 

Their first system purchased is a Vector 600, a lead-free compatible system that features an integrated computer with unlimited program storage, integrated system software, witness camera and auto fiducial correction. 

Available in either standalone or SMEMA in-line configurations, the Vector 600 is offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. 

The Vector 600 is UL and CE compliant and carries both a two-year system warranty and a four-year solder pot warranty.

Share




Suggested Items

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes

04/13/2022 | Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.



Copyright © 2022 I-Connect007. All rights reserved.