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A Game-changing component assembly methodology will transform product confidence in the harshest environments.
The weakest link
Most electronic manufacturing defects are related to the soldering process and most field failures occur as a result of solder weaknesses such as fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework.
The Occam Process is a game-changing solderless assembly technology that reorders the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing product size and cost. With Occam, solder-related failures are eliminated because solder itself is eliminated. The Occam approach bypasses the weakest link, inherently driving up product reliability while opening the door to a host of new capabilities and benefits for product designers.
Occam inventor Joe Fjelstad commented: “Occam isn’t just a new process but a reordering of current methods. It is an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm. Occam will transform the industry into something substantially simpler and better.”
Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?
Michelle Te, I-Connect007
Students, young professionals, and industry newcomers will have a unique way to network with subject matter experts at SMTA International 2022 in a fun and non-threatening way. “Passport to the World of SMT” is designed to assist “Explorers” in making connections with exhibitors during part of the annual trade show in Minneapolis.
Sal Sparacino, SMTA
SMTA International is just around the corner, and we are excited to be meeting fully in person and onsite. The conference and expo runs from Monday, Oct. 31 through Thursday, Nov. 3, returning to the Minneapolis Convention Center. Once again, we will co-locate with Medical Design & Manufacturing Minneapolis 2022 (MD&M). As the world continues to adjust to the new normal following nearly years of the pandemic, an in-person industry conference and exhibition is more valuable than ever.