Change in Incap’s Management Team

Reading time ( words)

Greg Grace will leave his position as Incap’s Director of Operations Estonia and Managing Director of Incap Estonia. The recruitment process for a new Director of Operations Estonia and Managing Director of Incap Estonia will begin immediately. Margus Jakobson, Member of the Incap Estonia Management Team responsible for QHSE, is appointed as interim Managing Director of Incap Estonia with immediate effect.

“I thank Greg Grace for his time in Incap and his contribution to the Estonian team’s work,” says Otto Pukk, President and CEO of Incap Corporation.

The members of Incap Group’s Management Team are currently Otto Pukk, President and CEO; Murthy Munipalli, Director of Operations India and Sales APAC; Jamie Maughan, Director of Operations UK; Miroslav Michalik, Director of Operations Slovakia and Antti Pynnönen, CFO.


Suggested Items

Implementing Digital Twin Best Practices From Design Through Manufacturing Webinar Review

01/27/2021 | Dana Korf, Korf Consultancy
I-007e recently released a highly informative series of short webinars called Implementing Digital Twin Best Practices from Design Through Manufacturing presented by industry expert Jay Gorajia, the Director of Siemens Global Digital Manufacturing Services. The webinar is an excellent overview how data that is generated using a digital twin model can be effectively utilized to improve business execution using the Siemens tool suite.

Meet Alfred Macha, SMT007 Columnist

11/06/2019 | I-Connect007 Editorial Team
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.

Selecting a Wave Soldering System, Part 3

02/01/2016 | Robert Voigt, DDM Novastar
In my last column, we discussed the attributes of the various types of wave solder systems, the most common through-hole assembly system for small- to mid-volume operations. In this chapter, we will dive a little deeper and address board handling techniques; in particular, the three common methods of running boards in wave soldering.

Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.