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Universal Instruments Highlights Precision Automation Solutions at IPC APEX EXPO 2023
January 19, 2023 | Universal InstrumentsEstimated reading time: 1 minute
Universal Instruments will feature its Precision Automation solutions on Booth 1749 at the 2023 IPC APEX EXPO, held at the San Diego Convention Center on January 24–26. On the booth, Universal will showcase its Uflex® modular automation platform and IQ360™ Factory Software Suite. Uflex is the ultimate flexible multi-process assembly cell, eliminating the need for hard-tooled systems. Universal’s IQ360 software suite integrates all facets of factory operations for optimal productivity.
Uflex accommodates an array of process modules, as well as a wide variety of feeding options to perform virtually any automation task. It supports up to four independent process modules on a single gantry, including vacuum or pneumatic placement, screw driving, UV curing, or dispensing. This unique architecture offers investment protection versus single-task custom cells and can lower the cost per insertion by more than 95% versus manual assembly processes while improving quality and yield.
The IQ360 Software Suite is a full complement of smart factory modules designed to control, monitor and improve production efficiency. Comprised of Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules, IQ360 offers individual capability bundles that meet specific factory requirements, providing a true “connected factory” production environment.
“Automating can be challenging for even a single product, but our customers need automation solutions that can adapt from one complex product to another,” noted Universal Instruments Vice President of Marketing, Glenn Farris. “Many of these products enlist a multitude of processes, such as high-accuracy alignment, flex handling, cutting and forming, inspection, and bonding. These precision automation applications are where we deliver the most value by leveraging our automation experience and breadth of technologies.” Farris added, “These applications are proliferating across markets including server/network infrastructure, IoT, high-reliability industrial, medical, mil-aero, mobility and automotive.”
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Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
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Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
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04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.