Integra: Redefining Die Prep in the U.S.

Reading time ( words)

Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.

For over 40 years, Integra has held its position as the largest outsourced semiconductor assembly and test (OSAT) operation in the U.S.—an accomplishment considering that most of our competition (and a few of our former owners) have given up on manufacturing in the U.S. altogether. Five years ago, customers and suppliers were saying things like, “When are you opening a facility in Asia?” and “What volume facility are you tied to?” Having a factory in the U.S. was considered laughable.

But with the arrival of COVID-19 and all its supply chain disruptions—not to mention the current precarity of global politics—there came a realization that we are increasingly dependent on Asia for manufacturing. The CHIPS Act has generated new discussions; now we hear comments like, “We’ve said all along that we need to bring manufacturing back to the U.S.,” and “We’re building a factory here too.” People who laughed when we had a U.S. presence are now asking if we can help them get substrates sooner.

While most folks were moving out of the United States, we were looking for ways that we could make U.S. manufacturing work. We focused on two core ideas: products that are differentiated, and customers that can’t or won’t go to Asia.

With respect to differentiated products, we specifically targeted unique processes, such as SiPho, III-V materials, etc.; unique and unruly requirements in low-volume quantities (qualification runs, DPA, test, etc.); and volumes that Asia typically will not accept. This last criterion also happened to fit with the space technology sector quite well. 

To read this entire article, which appeared in the January 2023 issue of SMT007 Magazine, click here.


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/27/2023 | Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

Ventec: Contextualizing the CHIPS Act

01/05/2023 | Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.

ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event

12/13/2022 | Pete Starkey, I-Connect007
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.