NIST Resources for CHIPS Act Participants

Reading time ( words)

Frank_Gayle.jpgAt the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act. 

In Gayle’s presentation, he said the vision for the CHIPS and Science Act (also known as the CHIPS Act) is to develop and preserve three key areas: economic security, national security, and future innovation. 

He emphasized that the CHIPS Act is about more than just the semiconductor chips, reserving an entire slide for that point alone. While NIST acknowledges that the U.S. holds an impressive 85% stake in the semiconductor design market, only 3% of the global packaging industry resides within the U.S. 


In support of this mission, Gayle drew attention to a series of resources that are now available on

  • Metrology and Standards
    “Strategic Opportunities for U.S. Semiconductor Manufacturing: Facilitating U.S. Leadership and Competitiveness through Advancements in Measurements and Standards,” August 2022. 
  • Stakeholder Input on CHIPS Act
    “Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry: Summary of Responses to Request for Information,” August 2022. 

  • Commerce Strategy for Implementation
    “A Strategy for the CHIPS for America Fund,” September 2022. 
  • Semiconductor Supply Chain RFI Findings
    “Results from Semiconductor Supply Chain Request for Information,” January 2022.

Gayle concluded that the Incentives Program application process will be announced in February 2023 with funding proposals considered on a rolling basis. Learn more about the CHIPS Act at 


  1. Data courtesy of the U.S. Department of Defense and IPC.

This article originally appeared in the January 2023 issue of SMT007 Magazine.


Suggested Items

Stanton Rak: Patient Leaders Nurture Growth

03/31/2023 | Patty Goldman, I-Connect007
Stanton Rak, principal at SF Rak Company, discusses his new IPC President's Award. He says a successful leader must demonstrate passion for what they do, and that working in an IPC leadership role requires a unique approach to collaboration. IPC’s diverse membership means leaders must cultivate patience and be open to relying on the expertise of their fellow professionals.

Teresa Rowe: Onward and Upward

03/30/2023 | Patty Goldman, I-Connect007
Teresa Rowe, IPC senior director, Assembly and Standards Technology, has been inducted into the Raymond E. Pritchard Hall of Fame. She looks back on her unexpected introduction to IPC and how both passion and perseverance have always been at the heart of our industry’s drive to innovate. Seize every chance to grow and learn, Teresa says, and always keep moving toward the next opportunity.

Gene Weiner: Setting the Standard

03/28/2023 | Patty Goldman, I-Connect007
Patty Goldman catches up with Gene Weiner, the longest-serving member of IPC, about his experience meeting with the next generation of engineers in IPC’s Emerging Engineers program through a unique contest held at IPC APEX EXPO 2023. Weiner, who has attended well over 60 annual IPC meetings, shared his unflagging optimism and the lessons he’s learned over his illustrious career with the young professionals who managed to find him at the show. With so much still to do, Weiner has no plans to retire any time soon; he’s already hard work helping IPC develop a new program to support aspiring managers in the industry.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.