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Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
In this role, Wang leads the China sales team and is responsible for all sales in the China region. He works with multiple departments to develop sales strategies and facilitate strong connections to customers throughout China.
Wang has more than 10 years of sales and multinational account management experience with focused knowledge of the semiconductor assembly and automotive electronic business sectors. Prior to joining Indium Corporation, he worked as vice sales director for assembly materials, bonding wires, DCB substrate, and thick films products at a German global materials company. Wang earned his bachelor’s degree in Medicine English at Sichuan University.
Nolan Johnson, I-Connect007
When Canadian artificial intelligence company Darwin AI was founded in 2017, machine learning and deep learning were still relatively new terms. In the past five years, CEO Sheldon Fernandez and his team have been working with this technology to develop some foundational IP to simplify implementation. About a year ago, Sheldon took a “part happenstance, part deliberate” opportunity to develop a vertical offering for EMS manufacturing. Here’s what happened.
Michelle Te, I-Connect007
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.