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Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
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Latest I-007eBook from GEN3 Focuses on Process Control
May 25, 2023 | I-Connect007Estimated reading time: Less than a minute
I-007eBooks is pleased to announce the release of the latest book in its The Printed Circuit Assembler’s Guide to…™ series.
The Printed Circuit Assembler's Guide to...™ Process Control, brought to you by GEN3 Systems and I-007eBooks, tackles critical aspects related to process control and the role of the SEC test in maintaining and providing objective evidence.
Written by GEN3 topic experts Dr. Chris Hunt and Graham Naisbitt, this book covers everything from 'open' and 'closed' loop circulation, corrosion prevention and ECM avoidance, to SIR tests for process verification, equipment and solution choices, and more. Readers will gain valuable insight into optimizing their assembly operations.
According to peer reviewer Mike Cummings: “This book is not based on fear marketing, but rather is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes.”
Download your free copy today here, as well as the first book in this two-part series, The Printed Circuit Assembler’s Guide to…™ Process Validation.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Control. View our full library at I-007eBooks.com.
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Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
03/18/2024 | SEMIThe new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/15/2024 | Andy Shaughnessy, Design007 MagazineIt was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself.
Join The Murray Percival Co. at IPC APEX EXPO 2024
03/15/2024 | Murray Percival CompanyThe Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, is excited to announce their participation in the upcoming IPC APEX EXPO, scheduled for April 9-11 at the Anaheim Convention Center in Anaheim, CA.
PAWR Announces 5G Open RAN Testing with Mavenir at POWDER Testbed
03/15/2024 | BUSINESS WIREThe Platforms for Advanced Wireless Research (PAWR) Project Office announces a collaboration between PAWR platform POWDER and industry innovator Mavenir to test a first-of-its-kind O-RAN 5G SA network deployment with millimeter Wave (mmWave) spectrum.
inTEST Expands Electronic Test Capabilities with Acquisition of Alfamation S.p.A.
03/14/2024 | BUSINESS WIRETerms of the acquisition are being filed separately with the Securities and Exchange Commission. Alfamation will become a part of the Electronic Test division within inTEST.