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Interview: David Bergman Discusses IPC's Agreement with Tsinghua University
February 25, 2008 |Estimated reading time: Less than a minute
The IPC has announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly. The program will be based on IPC-A-610, Acceptability of Electronic Assemblies; IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies; and IPC7711/7721, Rework, Modification and Repair of Electronic Assemblies and will be offered at approximately 500 secondary vocational schools throughout China.
Bergman talks in more detail about the relationship with Tsinghua University and how it will benefit the industry in China.The watch this exclusive interview, click here