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Flextronics Shares Investigational Findings on PoP and Large Format Assembly
May 5, 2008 |Estimated reading time: Less than a minute
Jenson Lee, Staff Engineer with Flextronics, delivered two papers at the SMTA China East Conference, held in conjunction with Nepcon China 2008. His first paper dealt with package-on-package as it relates to the hand-held and mobile devices market, the other with large format assembly--a process still in its infancy in China.