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SMART Group Publishes Lead-free Experience Report
October 6, 2005 |Estimated reading time: Less than a minute
The SMART Group, with support from LEADOUT, a European-wide lead-free project, developed the Lead-free Experience3 to assist small- and medium-volume producers. The third-annual Lead-free Experience offered engineers a hands-on experience with all aspects of lead-free materials and production equipment. Engineers also had the opportunity to see current process experiences on soldering, inspection, component requirements printed board design/specification and product reliability.
A report on the Lead-free Experience details printed board design; lead-free component testing; PCB solder finishes; stencil printing; soldering materials; wave soldering; convection and vapor phase reflow; optical, X-ray and micro-section inspection; and lead-free process defects. The report, produced by Bob Willis, SMART Group technical director, is available free-of-charge at http://www.smartgroup.org/experience/experience%20report%202005.pdf.