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On the Show Floor at SMT Hybrid Packaging: Exhibits Preview I
May 24, 2010 |Estimated reading time: 15 minutes
NUREMBURG, Germany — The following solders, flash programmers, reflow oven profilers, feeders and pick-and-place systems, printers, inspection systems, and other products will be highlights of the SMT Hybrid Packaging show, June 8-10 in Nuremburg. Stay tuned to SMT’s Website, www.smtonline.com, for more previews of the tradeshow.
Flashstream Automated Flash Memory Programming System
BPM Microsystems will feature the Flashstream 3000FS fine-pitch automated device programmer on distributor PB Tec’s booth 506, in Hall 7. The 3000FS combines the best qualities of BPM Microsystems’ 3000 series device handling system with Flashstream programmer site technology for production throughput up to 1100 devices per hour, producing a fully programmed 512Mb NAND flash every 3.4 seconds or 2 GB in 21 seconds. BPM’s proprietary co-processor technology Vector Engine Co-Processor gives the Flashstream low programming overhead, while maintaining the highest production quality programming signal. The 3000FS offers flexible options for input and output media with choices of tube, tray, or tape. On-the-fly vision centering allows the 3000FS to handle most semiconductor packages on the market today, including TSOP and BGAs, while maintaining full-handling throughput. http://www.bpmicro.com/
KIC’s MVP Profile Fixture
KIC International Sales Inc. distributor Multi Components GmbH will highlight the KIC MVP profile fixture in Hall 7, Stand 320. The MVP profile fixture allows assemblers to view changes in reflow ovens and determine how those changes affect the profile of production boards. The KIC MVP uses embedded sensor technologies that accurately measure the profile of an individual PCB without the need to use the actual PCB beyond the initial program run. Changes are instantly displayed on a profile graph, along with a single number that tells the operator whether the profile is in spec. When the MVP detects an out-of-spec situation, the software will inform the technician how to adjust the oven to achieve an in-spec process and quickly resume production. The MVP works with KIC’s SlimKIC and KIC Explorer lines of profilers. www.kicthermal.com
Random Access Feeder
Quasys will introduce the flexible JTF3 Random Access Feeder, a straightforward, low-cost feeder to allow processing several different devices from one feeder using very little rail space. The slightly increased width allows the use of a magazine, which stores multiple JEDEC trays individually addressed by the host system and moved to the pick position for unloading or loading. Key components of the JTF2 have been adopted : Very little rail space, easy to integrate, low cost, and short delivery. The JTF3 will be run in live demos at SMT Nuremberg, Halle 7, Stand 538.
Total PCB Assembly Concept from Assembleon
Royal Philips Electronics subsidiary Assembléon will show several recent developments to its pick & place range at Booth 7.549. Packing a PCB assembly line with 80,000 CPH and up to 220 feeders into only 4 square meters, the company’s MC-24 and MC-24X combination suits the mix and speed requirements of the European SMT industry. The MC-24 and MC-24X line can place 01005 chips up to 100 x 45 mm components with a maximum height of 15 mm. The machines accept board sizes from 50 x 50 mm up to 700 x 460 mm, making long-board production possible. Assembléon is building on its Smart Solutions campaign and partnership with Valor, showing its hardware and software for total PCB assembly, along with a new European web shop that simplifies the ordering of spare parts 24/7. New financial packages will also be discussed. Assembléon will also be showing its flagship AX-501 with new Twin Placement Robot (TPR) head. The TPR converts the A-Series into a combined chip and IC shooter on a single platform with IPC speeds up to 111,000 CPH and an accuracy of 25 µm. Alongside that, the company will show its MCP screen printer, which halves the industry’s benchmark defects per million (dpm) figures while cutting board cycle time to 11 seconds. The output from the MCP has a single-digit dpm matching that of the company’s A-Series pick & place machines. www.assembleon.com
CyberOptics Features New SPI and AOI Systems
CyberOptics Corporation (Nasdaq: CYBE) will feature their newest AOI and SPI systems at SMT Nuremberg. Systems that will be highlighted at the show include the new QX500 AOI system, the new SE350 3D solder paste inspection system and the SE500 100% 3D SPI system on booth 430 in Hall 7. The simple and robust SE350 is the newest addition to the 3D SPI system portfolio. Designed with CyberOptics’ calibration-free sensor technology, the SE350 eliminates machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry. Leveraging on the technology of SE500, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm). The new AOI QX500 combines a unique image acquisition solution to provide yet another industry-leading, high-speed inspection solution. The QX500 represents a quantum leap in inspection technology, system design and speed, with improved cycle times. The introduction of SIM enables the system to offer on-the-fly inspection, setting it apart from conventional inspection methods. The SE500 100% 3D solder paste inspection system has the ability to inspect the most demanding assemblies at >80 cm²/second inspection speed without compromise to measurement accuracy and repeatability. The SE500 systems can inspect pad sizes down to 01005s. www.cyberoptics.com
Indium Features Halogen-Free Pb-Free Solder Paste
Indium8.9HF Solder Paste is a halogen-free Pb-free solder paste with efficient print transfer and fast response-to-pause printing. The advanced rheology of Indium8.9HF suits advanced 0.4 mm pitch and 0201 technologies. As a halogen-free solder paste tested per EN14582 test method, Indium8.9HF possesses a unique activator package and oxidation barrier, which allows it to coalesce and wet as well as, or better than, its halogen-containing counterparts. The oxidation barrier also ensures there is no graping on small passives. Additionally, the combination of outstanding oxidation barrier and high slump resistance allows Indium8.9HF to effectively eliminate head-in-pillow defects. Indium8.9HF can be manufactured with SnPb powder so it can be used on products currently exempt from RoHS. Using Indium8.9HF in a SnPb process offers high thermal stability and very low voiding in mixed alloy applications. It also eliminates the need to change solder paste chemistry when transitioning to a RoHS-compliant environment. Indium will be exhibiting at Booth 7-430. www.halogen-free.com
DEK Showcases Productivity-boosting Solutions
DEK’s Stand 7-305 will showcase DEK’s print platforms, next-generation stencil technologies, Process Improvement Products, and more. The Horizon 01iX and Horizon 03iX print platforms will be shown with enhanced quick-access cover packages, and will exhibit fast changeover and 6-Sigma performance with scalability and easy in-field upgradeability Optional features include understencil cleaning, automatic board support, or dispense capability. Visitors can also catch the Horizon 01iX on the Fraunhofer Institute’s live production line running in Hall 6, Stand 430, using VectorGuard stencils, Over Top Snuggers substrate clamping, HD Grid-Lok high-density automatic tooling, Cyclone understencil cleaning, HawkEye print verification and next generation Instinctiv V9 user interface. The Sentinel print verification and process management technology will also be shown. It combines automatic verification, traceability, real-time process management and inspection capabilities. Sentinel delivers 100% inspection capability at the line beat rate. Also on display at Stand 7-305, DEK Productivity Tools on show include Stinger advanced on-board dispensing technology and Over Top Snuggers substrate clamping technology. The DEK team will also highlight its latest stencil advance, VectorGuard Double Layer Platinum. VectorGuard Double Layer Platinum enables fine line printing at <2 mils or 50 µm. SMT Nuremberg visitors will also be able to witness a live demonstration of DEK’s Process Improvement Products. A dedicated on-stand laboratory will put a wide range of Understencil Cleaning Rolls and Understencil Cleaning Agents to the test. www.dek.com
Kester’s Next-generation Solder Paste and Flux
Kester’s recent breakthrough in lead-free technology, NXG1, a lead-free no-clean solder paste, will be highlighted at the show alongside 979T VOC-Free No-Clean Flux and 985M Lead-Free No-Clean Alcohol-Based Flux. Visitors will also have an opportunity to meet Kester’s new European Sales Manager, Michael Fullbrecht, and discuss their solder materials challenges with Kester representatives on distributor Eurotool’s stand, Hall 9, Booth 512H. NXG1 has been developed for ultra-low BGA voiding, superior wetting, long shelf life, good printing, and excellent joint appearance. In response to the burgeoning solar industry, Kester has developed a series of no-clean flux to support customers in this sector. Included in the range is the 979T, a 100% VOC-free, no-clean flux formulation for high quality, low defect soldering. Designed specifically for tab attachment, the product offers high reliability with low residues after soldering that are benign and non-conductive. 979T VOC-Free No-Clean Flux is specially formulated with a unique proprietary blend of organic activator systems to offer the best wetting and topside hole fill and shiniest solder joints. Kester 985M Lead-Free No-Clean Alcohol-Based Flux helps improve effectiveness in wave soldering of conventional circuit board assemblies. This flux was developed for excellent solderability and through-hole fill in lead-free wave soldering process. 985M minimizes micro-solderballing at connectors and CPU. Its residue left behind is non-tacky, non-corrosive and non-conductive. www.kester.com
AdoptSMT’s Pre-owned SMT Assembly Equipment for Europe
AdoptSMT will show its new products at the SMT trade fair in Nuremberg, at Hall 7, booth 102. The company has improved availability of spare parts, broadening the network of suppliers, especially in the US and Asia regions. AdoptSMT will present the latest product stock of Siplace and Mydata systems and many more fine-pitch placement machines, stencil printing machines, coating systems etc. New products include Techspray Cleaning/Coating Tools and JBC Solder Tools. AdoptSMT will showcase its latest Digital FeederMaster, which has been designed and manufactured to meet today’s exacting standards in feeder accuracy. It has been developed based on the experience and success of its predecessor, raising feeder testing and calibrating to a new and higher level. One-on-one consultations with AdoptSMT are available on the booth. AdoptSMT also offers a range of training courses with engineers on location and in its facilities in Grödig, Salzburg and Paderborn. Basic Training for handling, programming and servicing placement machines are offered as well as process technical Training, which includes stencil printing, dispensing, soldering and cleaning. www.AdoptSMT.com
Kyzen Offers Cleaning Products for Any Process
During the show, Kyzen will feature EXAKLEAN E5612 ready-to-use stencil cleaner for use in all types of stencil cleaning systems. EXAKLEAN E5612 is ready-to-use on delivery and the aqueous based cleaning chemistry can be used in all types of stencil cleaning systems. Designed to clean all raw solder paste and fluxes at ambient (room) temperature, EXAKLEAN E5612 contains no solids, therefore no water rinsing is required. The pH neutral chemistry allows for high throughput with fewer defects, with no foam and low odour and has tested compatible with stencil materials and standard stencil cleaning equipment. The Kyzen Applications Laboratory has evaluated EXAKLEAN E5612 for effective removal of nearly 300 soldering materials. Kyzen’s line of cleaning technologies has been developed according to increasing demand for advanced cleaning chemistries. The company continually tests their products against the latest soils in every aspect of manufacturing and strives to continually improve products to address current and future cleaning issues such as white residue, more densely populated boards and environmental concerns and restrictions. Visitors to the SMT Nuremberg show are welcome to meet with Kyzen representatives and discuss their cleaning process requirements in hall 7, on stands 531 and 537. www.kyzen.com
FINEPLACER core Professional SMD Rework
During the trade show SMT/Hybrid/Packaging 2010, Finetech is going to present its new SMD soldering and rework station FINEPLACER core. The entry model for professional SMD rework addresses primarily small and medium sized enterprises (SME) that are planning to invest in a cost-effective and comprehensive solution with a wide range of applications. FINEPLACER core allows safe rework of typical SMDs with chip sizes ranging from 0.25 to 50 mm on board sizes up to 400 x 300 mm. The rework system, with hot air soldering technology, has coordinated control of all process and environment variables as well as the harmonized interaction of top and bottom heating. With respect to components and board size, only the necessary heat is being conveyed. For optimized soldering results, FINEPLACER core supports the use of nitrogen and other process gases. A full rework cycle can be integrated into the machine, including de-soldering and soldering, component removal and site cleaning, re-balling (array), paste printing (component or board), paste dipping and fluxing. Its heart is the patented FINEPLACER vision alignment system (VAS). Following alignment, automated processes with force measurement allow for a user-independent process control and reproducible process results for delicate components. The combination of process camera and LED lighting gives real-time visual feedback and contributes to fast process development just as much as the self-adapting profile library contained in the soldering software. This makes it possible to easily use and adapt processes for new applications. http://www.finetech.de
MIRTEC Presents AOI and SPI
MIRTEC will present their most technologically advanced AOI and SPI systems. The newest systems on show include the MV-7xi In-Line AOI System, MV-3 Series Desktop AOI System and MS-11 In-Line SPI System, along with Intellisys software. Visitors are invited to demonstrations on distributor pb tec’s stand, 506 in Hall 7. Total quality management system software Intellisys enables continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies. The software also provides monitoring of up to eight production lines and remote debugging. Typical programming time is less than an hour per assembly and allows the user to track and eliminate defects on inspected assemblies. MV-7xi In-line AOI system suits high-density PCB manufacturing requirements. Featuring a 5 MP digital camera with a Precision 9.8 µm Telecentric Compound Lens and 5 MP Side-View Cameras, MV-7xi is configured with MIRTEC’s Intelli-Scan Laser System to measure the Z-height of a given region of interest. Using simple and fast programming tools, the system provides lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices and enhanced solder paste measurement capability. The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-3 Series Desktop AOI System features the Intelli-Beam Laser System and is configured with a Top-Down View 5 MP camera. The system also features Precision 9.8 µm Telecentric Compound Lens and four 5 MP Side-View Cameras and a Remote Debugging Function for perfect re-inspection by the operator with 360° images from side on defect. MIRTEC’s MS-11 3D In-Line SPI System will also be on show. Using Shadow Free Moiré Phase Shift Imaging Technology and ‘Phase Stepping Image Processing’ to inspect solder paste deposition on PCB’s post screen print, the MS-11 will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. Configured with an ultra high resolution 4 MP Camera System, the MS-11 uses the same platform as MIRTEC’s MV-7 Series. www.mirteceurope.com, www.pbt.de
The Balver Zinn Group and Cobar Europe BV Highlight Advanced Solders and Soldering Materials
The Balver Zinn Group and Cobar Europe BV will showcase a complete range of advanced solders and soldering materials on booth 9-340 at the upcoming SMT Nuremberg show. Balver Zinn will feature the i-SAC series of optimized alloyed SnAg solders. With the addition of Cobalt (Co), the solidification characteristic of silver-containing alloys has been improved to offer an optimized lead-free solder. Co produces shiny solder joints with a fine grain microstructure, in comparison to standard SnAg-alloys. The i-SAC 387 solder contains Co and is also formulated with Germanium (Ge), which plays the role of antioxidant and minimizes dross formation. i-SAC 387 has a melting temperature of 217°C and a specific gravity of 7.5g/cm³. Tin/silver- (Sn/Ag-) based i-SAC 105 has silver composition on request between 0.5-1.5%. i-SAC 105 produces affordable, bright and shiny solder joints and a fine grain microstructure, even with the low addition of silver content. Co is also responsible for a homogenous microstructure. i-SAC105 has a melting range of 217°-227°C and a specific gravity of 7.4 g/cm³. Balver Zinn will also feature the SN100CS solder, the newest variant of SN100C. Due to its Ge content of 100 ppm (0.01%), SN100CS minimizes dross formation in ambient soldering processes without nitrogen. Depending on the type of machine being used, a dross reduction of up to 40% can be achieved. Positive side effects of increasing the Ge content include higher creep strength, better thermal conductivity and improved wetting properties. Balver Zinn recommends using Solder SN100CS for both the first fill and the refill alloy. The lower surface tension has a positive influence on the flow rate of the solder. The SN100C series also makes it easier to maintain the composition of the solder bath within specification, due to the lower level of copper leaching. www.balverzinn.comCobar Europe BV will highlight new environmentally friendly fluxes, featuring a low-VOC flux, Cobar 95-DRX. This flux is based on a water/solvent combination and offers improved soldering performance, as well as wicking characteristics that approach a solvent-based system, resulting in a perfect soldering performance. Cobar will introduce a new VOC-free flux, Cobar 396-DRX, at the SMT show. The new odorless flux is RoHS-compliant and maintains excellent soldering performance. Both halide- and halogen-free, Cobar 396-DRX is based on a water carrying system that provides advantages in transportation and storage conditions, and eliminates fire risks. According to IPC-J-STD-004, the Cobar 396-DRX and Cobar 95-DRX are classified as ORL0. In addition to these fluxes, new stronger versions called Cobar 396-DRX-M and Cobar 95-DRX-M are now available. These fluxes are classified ORM0 and provide excellent soldering performance in the toughest applications, leaving no visible residues. Cobar will also introduce its Aquasol Branded Water Soluble Solder Paste, which can be used with any commonly used soldering alloy. SnPb and lead-free versions are available, all exhibiting excellent performance in the four key process steps: printing (including fine-pitch capability), placement, reflow and cleaning. There is efficient separation from the squeegee and good aperture release with long stencil life. With Aquasol Branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. The rosinous nature of this water-soluble paste is unique, with paste rheology, solder ability and water wash ability conferred by carefully selected surface chemistry and activators. Furthermore, the paste features excellent slump resistance and residues can be removed with de-ionized water. Voiding is also minimized in both air and nitrogen processes. www.cobar.com
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