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Flexible Printed Circuit Boards: Global Strategic Business Report
May 5, 2010 |Estimated reading time: 2 minutes
DUBLIN — This report from Research and Markets analyzes the worldwide markets for flex PCBs by end-use markets and production region (2007-2015). It includes an introduction to flex circuits, including PCB types, materials used to make flexible circuits, and the benefits of using flex over rigid PCBs.
Asia-Pacific continues to dominate the global flex circuit market. Japan continues to be the main region for flexible circuits production, though China is catching up fast. Production is relocating to low-cost countries. EMS providers are gaining prominence. Less complex FPCs dominate the global FPC market.
The communications end-use segment leads usage, while consumer electronics post the fastest growth. Major applications of flex PCBs include automotive, communication, computing, consumer electronics, defense and aerospace, industrial and medical sciences, and packaging. Wireless telecommunications are spawning significant demand. Mobile phones are a key application area for flex circuits.
The report includes an explanation of single-layer FPCs, single- and double-sided; multilayered flex circuits; rigid-flex boards; and other select types. Double access flexible circuits, sculptured flex, and backplane technology are explained.
There are increased R&D efforts in substrate materials, according to Research and Markets. Polyimide leads the FPC substrate materials domain, but the demand for new materials is predicted to surge. Adhesiveless laminates are gaining popularity. Materials used in flex circuit manufacture include a base material, polyimide, polyester, conductor materials such as copper or non-copper metal foils, adhesives and epoxies, and protective coatings.
The two generic methods of flex circuit manufacturing are covered, with information on coverlay film, the subtractive manufacturing method, image resist and resist removal, cover layer placement, creation of outlines and holes, and test/verification steps.
Product-related advantages fuel market growth in this PCB sector. Key advantages of flex circuits include package size and weight minimization, and reduced assembly time and cost. Errors in assembly also go down. System reliability can be improved.
Region/Country Players The United States46Canada3Japan14 Europe60 France5 Germany25 The United Kingdom12 Italy6 Rest of Europe12 Asia-Pacific (Excluding Japan)35 Middle East2The report profiles 154 companies including many key and niche players worldwide such as 3M, Amphenol Corp, Benchmark Electronics, Inc., Career Technology (MFG.) Co., Ltd., Flexible Circuit Technologies, Inc., Fujikura Ltd, Hutchinson Technology, Inc., Innovex, Inc., MFS Technology Ltd., Minco Products, Inc., Molex, Inc., Multek Flexible Circuits Inc., Multi-Fineline Electronix, Inc., Nan Ya PCB Co., Ltd., Nippon Mektron, Ltd., Nitto Denko Corp., Northpoint Technologies, Inc., Parlex Corp, Si Flex Co., Ltd., Sony Chemical & Information Device Corp., Sumitomo Bakelite Co., Ltd., Sumitomo Electric Industries, Ltd., and Youngpoong Electronics Co., Ltd.
For more information, visit http://www.researchandmarkets.com/product/900108/flexible_printed_circuit_boards_global_stra
Read more about flex circuits in What Are Flex Circuits, and How Do We Use Them? SMT editor Meredith Courtemanche summarizes flex circuit design, manufacturing, and implementation best practices from Mark Finstad and Mark Verbrugge, Minco. Some of their advice may surprise you.
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