-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC APEX EXPO 2010: Exhibits Preview V
March 23, 2010 |Estimated reading time: 14 minutes
— IPC APEX is coming up April 6-9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes various materials from Taiyo America; inspection technology from CyberOptics; flex cutting services from A-Laser; soldering advances from Vitronics Soltec; DEK's printing technologies; assembly materials from Henkel; Electrolube cleaning products; supply chain solutions from Calumet; fixturing from ECT; Milara's print systems; PCB supports from Production Solutions; XRF from RMD Instruments; and a new cleaning formulation from Kyzen.
Follow all of the happenings on the APEX show floor with SMT’s Website, and via our Twitter feed, www.twitter.com/surfacemount. Also check out our other APEX previews and coverage.
Taiyo America Promotes Innovative New Products
High density circuitry combined with the need for laser direct imaging (LDI) imaging of inner- and outer-layer circuitry has driven the need for high-productivity LDI imaging of solder mask and even legend ink with high yield. LDI imaging eliminates losses and rework for misregistration and time for scaling of hard phototools. The following LDI products will be highlighted: PSR-4000 LDI (US) Green & Colors - Taiyo has expanded the PSR-4000 LDI (US) solder mask line of products to include red, blue and clear versions that complement the original dark green version. These products may be exposed with as little as 50-75 mJ/cm2 and offer excellent productivity compared to conventional solder masks in LDI exposure. PSR-9000 LDI Green & Amber - These flexible photoimageable covercoat materials give the same LDI capability for flexible circuit applications. The green version of PSR-9000 LDI that is color compatible with typical rigid solder masks is a new addition to the product line. PSR-4100 LDI - The density, registration and dimensional requirements for legend inks have become more critical than for other imaging processes. Conventional screen printing and exposure processing cannot satisfy the legend and marking needs without rework and yield loss. Additional new products being promoted at IPC APEX Expo include IJR-4000 White Inkjet Legend Ink, initially formulated for Orbotech Sprint-8 units and soon available for other formats. IJR-4000 has excellent adhesion to fully cured solder mask, high cured hardness and is bright white. PSR-4000 QD solder mask is formulated for installations using infrared tack drying ovens, often associated with spray solder mask application equipment. It provides excellent trace coverage, has a wide processing window and is compatible with typical final finishes. PSR-9000 FLX Colors are new for flex circuit photoimageable covercoat applications: white and black versions that complement existing green and amber products. S-200W LP is a longer pot life screen-printable thermal cure legend ink with good color stability through multiple lead-free soldering operations.Thermal Management Coatings in dielectric and solder mask coatings have high thermal conductivity to aid in thermal dissipation for PCBs having high temperature devices such as LED components.Several series of conductive ink products for screen printed circuits for touch pad, RFID, flat panel, solar and other printed electronics applications are formulated for each specific application. Taiyo Ink Manufacturing Co. Ltd. (Tokyo), www.taiyo-america.com, Booth 1041.
CyberOptics to Unveil Latest Inspection Equipment
CyberOptics will feature its latest inspection equipment with image acquisition technology for automatic optical inspection (AOI) and zero machine-to-machine variation 3D solder paste inspection (SPI) systems. CyberOptics will display the SE500 100% 3D solder paste inspection system at the show. The SE500 has a >80 cm2/second inspection speed with measurement accuracy and repeatability. It can inspect pad sizes down to 01005 component size while keeping up with line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 × 50 mm to 510 × 510 mm. The SE500X can transport panels from 100 × 100 mm to 810 × 610 mm. CyberOptics Corporation (Nasdaq: CYBE), www.cyberoptics.com, Booth 2271.
A-Laser to Exhibit Flex Services
A-Laser, laser cutting services provider specializing in the ablation of ultra-thin metals and plastics, will exhibit its Flexible Circuit Processing services. The company understands the increasing demand for fast turns on high-quality products. Devices continue to become smaller and more intricate in design, surpassing the capabilities of hard tooling and mechanical drilling. A-Laser’s flexible circuit applications include laser skiving, laser routing and depaneling. A-Laser provides high cutting edge precision and position accuracy (±0005"), fine contours and virtually radius-free internal edges (<20 µm beam), and contact-free material processing to prevent material distortion. Same day quotes and 24-hour turnaround also are available. A-Laser, a division of FCT Assembly, www.a-laser.com, Booth 2317.
Vitronics Soltec Showcases Selective Soldering, Reflow Set-up Advances
Improvements and advances in selective soldering technology include a significant increase in processing speed in the new ‘Enhanced’ mySelective 6745 system. The faster speed is due to a new parallel processing design and dual soldering nozzles that increase throughput to nearly double its original output. The compact Enhanced 6745 makes set up fast and simple using the ‘Easyteach2’ program. Vitronics Soltec will also exhibit its XPM3 Reflow System equipped with the new AUTOset fast set up feature. AUTOset allows the manufacturing engineer to accelerate process development by generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. The engineer can then fine tune an optimized profile from the preliminary recipe if needed. However, 85% of the time the engineer doesn’t need to modify the auto-created profile. AUTOset effectively controls the major elements in a reflow thermal profile: Ramp-up heating rate, thermal soak, time above liquidus (TAL), peak temperature, and total heating time. AUTOset shortens the process development learning curve, can be used by all system operators and is not individual-dependent. Vitronics Soltec, www.vitronics-soltec.com, Booth 1073.
Kyzen to Debut AQUANOX A4703
Kyzen will feature AQUANOX A4703 Neutral pH Aqueous Cleaning Chemistry. An aqueous cleaning solution designed with a pH neutral formulation, AQUANOX A4703 is combined with Kyzen’s inhibition technology to provide superior material compatibility. Additionally, it is effective at concentrations as low as 3%, while being environmentally friendly and providing low cost of ownership. This chemistry was developed for use in spray batch and spray in-line cleaning systems to remove OA, no-clean, and RMA pastes and fluxes, including difficult lead-free residues. AQUANOX A4703 is controlled by refractive index, manually or when using an automated process control system such as the Kyzen PCS. It is available in one, five, and 55 gallon containers. Kyzen Corporation, www.kyzen.com, Booth 2241.
DEK Unveils Higher Print Performance
The DEK display at APEX 2010 will showcase the recently enhanced Horizon platform to complete print process control tools to next-generation stencil technologies. The Horizon 01iX and the Horizon 03iX print platforms are cost-effective and in-field-adaptable printers, which will be shown at APEX with newly redesigned cover packages to enhance usability and operator management. The covers enable quick access from the front and rear of the system. Fast changeover and 6-Sigma performance are the basis of all of the Horizon iX models, with scalability and easy in-field upgradeability. Users can determine the Horizon model that best suits their manufacturing requirements today, with the option to add advanced features such as ultra-fast understencil cleaning, automatic board support or dispense capability when manufacturing needs change. The Sentinel, a complete print process safeguarding and control tool, will be demonstrated at APEX on-board the Horizon 01iX. With 100% post-print inspection at full line speed, Sentinel isolates bad boards in real time without adversely impacting the production pace. It incorporates full input and output verification along with sophisticated Verification and Traceability tools. The ProFlow ATx enclosed head print system and the company’s latest stencil advance, VectorGuard Double Layer Platinum, will also be displayed. ProFlow ATx incorporates a low-volume print chamber with an innovative paste loading mechanism for filling of the transfer head. Allowing for direct automatic material loading from industry standard packaging -- as opposed to special cartridges -- ProFlow ATx reportedly minimizes manual intervention, reduces cost, and lowers material waste. Based on the VectorGuard stencil tensioning technology, DEK developed VectorGuard Double Layer Platinum. The stencil’s design enables printing fine lines (<2 mils or 50 µm), said to be more effective than traditional screens for applications such as low temperature co-fired ceramic (LTCC), microelectronic packaging and processes that dictates high tolerance, fine dimension printing. All three of these products have been selected for IPC’s prestigious Innovative Technology Center and will be featured in a special display just outside the entry to the APEX exhibit floor. DEK, www.dek.com, Booth 1573.
Henkel Demos Assembly Materials
Henkel will display its Multicore portfolio, including Multicore LF620 lead-free solder paste. During the show, this robust, high-performance paste will be demonstrated on-board DEK’s Horizon 03iX print platform. Live print demonstrations will take place April 6 through April 8 from 2 to 3 pm. Henkel materials specialists and DEK solutions engineering staff will be on-hand to discuss specific process requirements. In addition to live printing demonstrations, the Henkel booth will also host Cavist’s Moldman system, which processes Henkel’s Macromelt low-pressure molding material to encapsulate circuitry. For certain applications, Macromelt technology can eliminate messy potting processes and allows for circuitry protection and the formation of the product’s outer shell in one simple step. On-demand demonstrations will take place throughout the 3-day APEX event. Henkel’s APEX display will also include PowerstrateXtreme – Printable (PSX-P), a printable phase change thermal interface material (TIM) that allows for precise thickness control and automated processing via a stencil printing process. PSX-P was selected as one of the key technologies for IPC’s Innovative Technology Center, in a technology display located at the entrance to the APEX exhibit hall. Henkel, 888-9-Henkel; Booth 2159.
Electrolube Introduce Latest Additions to the U.S. Market
Electrolube will showcase a number of its new products to the American market, and will introduce VP of HK Wentworth Americas John Bova. With Electrolube’s strategy to develop its North American operations by strengthening its distribution channels, Bova, formerly sales manager and global sales and marketing director at PVA, joins at an important time in the company’s plans. Bova will join the team at the exhibition to meet with existing and new clients and introduce a number of Electrolube’s new ranges, including the environmentally-friendly non-VOC (volatile organic compounds) conformal coating range, designed to meet the high performance of solvent-based coatings with minimal changes to processing parameters. Also on display will be the fast-drying DCA-FD, a modified silicone conformal coating that offers increased solid content, giving 35% greater coverage per liter. Finally on show will be Safewash Total, the newest product in the Safewash range of aqueous cleaning products. The Safewash range is currently in use by major global manufacturers in a wide variety of cleaning machines. It meets military and commercial standards reportedly at minimal financial and environmental cost. Safewash Total is a specially formulated blend of non-flammable solvents, which form a micro-emulsion when mixed with water. Designed for cleaning PCBs, it suits removal of leaded, lead-free, and no-clean flux residues. The cleaner also removes pastes and adhesives from screens, stencils, boards, and accessories and can perform general degreasing. It is a low-foam cleaner for use in dishwasher and in-line pressure systems, as well as ultrasonic and spray under immersion applications. It is surfactant free for easy rinse and can be used at low temperatures. Electrolube, www.electrolube.com, Booth 2459.
Calumet to Exhibit at IPC APEX Expo 2010
Calumet Electronics Corporation will feature "A Legacy of Performance, A Future of Innovation!" that covers its history manufacturing mission-critical PCBs and new technologies. The legacy of high-reliability performance with dock-to-stock dependability is combined with modern manufacturing innovation for manufacturing PCBs at Calumet. Advanced process capability improves quality, increases throughput and drives down cost. Calumet's Dock-To-Stock Supply Chain Solutions offer an alternative approach to managing supply-chain events. The Dock-To-Stock Supply Chain Solutions are based on the performance of Calumet boards and help reduce the costs of quality, inventory, and life-cycle management. Calumet Electronics, www.calumetelectronics.com, Booth 1126.
ECT’s Fixture Services Group Demos New Products
The ZOOM test fixture is designed for ultra-fine-pitch probing of loaded PCBs, and can test down to 24-mil (0.6 mm) centers and 15-mil-diameter targets. Finding locations for test points on traditional 50-mil centers or even 39-mil centers with 18-mil-diameter targets is difficult. 90% test coverage is accomplished by inserting a tilted pin plate stack between the device under test and a grid of 100-mil probes. The cost of a tilted pin plate stack and 100 mil probes is far less than the cost of using the 0.8-mm probes available on the market today. Any tester type can be used, but the ZOOM fixture uses conventional wiring methods. The MetriX was designed for close center probing of loaded PCBs, and provides test access down to 39-mil (1 mm) centers and 18-mil-diameter targets. MetriX probes are available with traditional high-performance gold plating, a range of spring forces, and ECT’s proprietary LFRE plating for increased life and resistance to contamination. The receptacle-less design allows a 50-mil-diameter probe to be used in 39-mil locations. Manufacturing lead time for MetriX fixtures is comparable to that of conventional fixtures. ECT will demonstrate its pneumatic fixture and ICT fixture systems. Also on display, its Dual Stage Mechanism is a reliable mechanical (no power required), dual-stage mechanism for in-circuit test fixtures that allows for testing in two stages. Applications for dual stage include in-circuit/functional, boundary scan, flash programming, or analog and powered testing for switched power supplies. It also is easy to activate and deactivate during fixture debug. Everett Charles Technologies (ECT) Fixture Services Group (FSG), a subsidiary of Dover Corporation (NYSE: DOV), www.ectinfo.com, Booth 1283.
Milara Will Debut Printing and Placement Equipment
TD2929 is a fully automatic in-line printer that offers dot dispensing capability for flexible solutions using Piezo dispensing technology and high-speed operation at less than 5 seconds (excluding print). Milara will introduce SimuTech Technology on the TD2929. A twin track system with dual overhead gantries allows for print, 2D inspection, bottom-side stencil cleaning and dot dispensing simultaneously on two PCBs. Additional features include a dual digital servo positioning loop for highest possible alignment accuracies, paste bead dispense while printing, linear servo motion technology and heavy-duty construction for extra stability in multifunction operation. The system features Milara’s patented vibration printing and ultrasonic cleaning, and provides high-density bottom-side contour tooling support. Milara will feature its TouchPrint TD2929 with dot dispensing and dual 2D post-print inspection, as well as its TouchPrint TD2929 with the new CyberOptics’ 3D post-print inspection head. Also at APEX, Milara will premier the P3, which combines a high-speed printer and pick-and-place system ? the Touch Print Digital TD2929 and the Mx400LP Pick-and-Place System with tray and max feeders. The P3’s economical compact size ensures maximum productivity per unit area. The dual-lane conveyor enables two PCBs to be processed simultaneously. The P3 is able to reach a placement speed of 31,000 CPH. It has an ultra-fast power-up and changeover time. Milara also will highlight the H1, H3 and H4 Diamond Series atmospheric wafer handling robots. The robots use ultra-low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive gears. Two independent arms (R1 and R2) attached to a common royalty axis (T) allow fast swapping or simultaneous transfer of two wafers. Native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment. Milara Incorporated, www.milarasmt.com, Booth 2219.
Production Solutions to Showcase New Products
The RED-E-SET products are designed to reduce changeover and eliminate component damage once implemented on any screen printer, pick-and-place, chip shooter or dispensing machine. The RED-E-SET Ultra HD is a high-density board support. The RED-E-SET SZ Center Support provides automatic board support for pick-and-place applications that need center board support installed in the machine. It has manual or automatic locking. The RED-E-SET Autoset provides automatic board support. The RED-E-SET VB Vacuum Box is Production Solution’s latest product for the MPM printers with the vacuum box. The RED-E-SET Lead-Free modules are anodized Green and when used in conjunction with the Red units, enable users to separate tooling between lead-free and leaded processes. This gives operators a color-coded confirmation that the correct tooling is being used and eliminates any concern of cross contamination. Production Solutions Inc., www.production-solutions.com, Booth 2150.
RMD Instruments to Highlight the Latest Feature for its LeadTracer-RoHS System
RMD’s solder analysis and identification feature on its LeadTracer-RoHS XRF system accurately identifies all solder alloys within minutes. Applications include rework or repair, solder pot analysis, and tracking changes in the assembly process. This is especially beneficial for SAC alloys in which an increase in Cu and Pb content (due to component drag-out) can affect the soldering process and RoHS compliance status. Recommended testing situations include boards going through second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches due to line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas; and components from placement reject trays. The LeadTracer-RoHS’ ability to analyze the entire energy spectrum and the entire component eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process. The XRF system is available with a sample preparation stand, ergonomically designed for ease-of-use and accuracy, with a “quick disconnect” grip. RMD Instruments Corp., www.rmd-leadtracer.com, Booth 349.
Join the PennWell SMT Group on LinkedIn
Become a Fan on SMT's Facebook Page
Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.