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New Solder Pastes Bring Testability, Jettability, and Compliance
March 18, 2010 |Estimated reading time: 1 minute
— FCT Assembly introduced a pin-probable solder paste for easy testing; MYDATA certified a leaded solder paste from AIM for jet dispensing; and Henkel debuted a halogen- and lead-free solder paste.Pin-probable Solder Paste
NL930PT no-clean, lead-free, halide-free test-pin-probable solder paste is a clear residue paste that can print in low surface area ratios consistently. Combined with SN100C, the solder paste produces cosmetically appealing solder joints. The robust paste can be used with SN100C and SAC305 lead-free alloys. Print release reaches down to 0.55 SAR when used with the Slic Stencil. NL930PT features high-speed stencil printing up to 200 mm/sec with excellent low voiding performance that exceeds IPC Class III requirements. The paste also features enhanced tack performance and printer open time. The paste has no halides. NL930PT features excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, SN100C, and HAL. The paste displays repeatability and consistency in temperatures from 65° to 85°F and relative humidity of 25 to 65% RH. This product is a drop-in replacement for most solder pastes currently used. FCT Assembly, www.fctassembly.com
Leaded Solder Paste for Jet Printing
MYDATA certified a new leaded solder paste from AIM for the MYDATA MY500 Jet Printer. The certification is the latest in AIM and MYDATA’s ongoing work to develop superior jet printing technologies, and follows the launch of AIM’s lead-free paste for the MY500 in 2009. Aerospace and defense industries prefer to use leaded solder paste, and are well-served by jet printing. The MYDATA Jet Printer is also compatible with solder paste from Almit, Alpha, Senju, and SMA from Heraeus. MYDATA automation AB, www.mydata.com and AIM, www.aimsolder.com
Lead- and Halogen-free Paste
Multicore HF108 is a high-performance lead-free, halogen-free solder paste, with zero deliberately added halogens, which puts it under the limit of detection in oxygen bomb/ion chromatography testing. Multicore HF108 has been formulated for low voiding in fine-pitch BGAs and CSPs, acceptable for a range of surface finishes including immersion silver and OSP copper. Benefits include excellent coalescence even after eight hours of exposure to 80% RH, colorless residues for speed and ease of post-print inspection, and good slump resistance. Henkel, www.henkel.com/electronics
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